Pardeep Shahi
发表
D. Agonafer,
S. Saini,
Pardeep Shahi,
2020,
2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
D. Agonafer,
S. Saini,
Pardeep Shahi,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Dereje Agonafer,
Rajesh Kasukurthy,
Satyam Saini,
2021,
Journal of Electronic Packaging.
D. Agonafer,
Amirreza Niazmand,
S. Saini,
2020,
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
D. Agonafer,
Amirreza Niazmand,
S. Saini,
2020,
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
D. Agonafer,
Amirreza Niazmand,
S. Saini,
2020,
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
D. Agonafer,
Amirreza Niazmand,
S. Saini,
2020,
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Ashish Kumar,
S. Saha,
Pardeep Shahi,
2018,
Proceedings of the 4th World Congress on Mechanical, Chemical, and Material Engineering.
D. Agonafer,
Michael Bozlar,
Pardeep Shahi,
2021
.