P. Hall

发表

Applications of grain boundary diffusion studies to soldering and thermocompression bonding

N. Panousis, P. Hall, 1978 .

Diffusion problems in microelectronic packaging

P. Hall, J. Morabito, 1978 .

Thermal Deformations Observed in Leadless Ceramic Chip Carriers Surface Mounted to Printed Wiring Boards

T. Dudderar, P. Hall, J. Argyle, 1983 .

Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards

P. Hall, 1984 .

Creep and Stress Relaxation in Solder Joints of Surface-Mounted Chip Carriers

P. Hall, 1987 .

On Using Strain Gauges in Electronic Assemblies When Temperature Is Not Constant

P. Hall, Richard A. Deighan, 1986 .

Resistance calculations for thin film patterns

P. M. Hall, P. Hall, 1968 .

Diffusion mechanisms in the Pd/Au thin film system and the correlation of resistivity changes with Auger electron spectroscopy and Rutherford backscattering profiles

J. Poate, P. Hall, J. Morabito, 1976 .

Effect of Stress on the Superconducting Transition Temperature of Thin Films of Tin

P. Hall, 1965 .

Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated Aging

N. Panousis, P. M. Hall, N. Panousis, 1975 .

Temperature Dependence of Thermal Expansion of Materials for Electronics Packages

P. Hall, R. Chanchani, 1993 .

Compositional depth profiling by auger electron spectroscopy

P. Hall, J. Morabito, 1978 .

A formalism for extracting diffusion coefficients from concentration profiles

P. Hall, J. Morabito, 1976 .

Superconducting Thin Films of Niobium, Tantalum, Tantalum Nitride, Tantalum Carbide, and Niobium Nitride

P. Hall, D. Gerstenberg, 1964 .

ELECTRICAL RESISTIVITY OF YTTRIUM SINGLE CRYSTALS

S. Legvold, F. H. Spedding, P. Hall, 1959 .

ELECTRICAL RESISTIVITY OF DYSPROSIUM SINGLE CRYSTALS

F. H. Spedding, P. Hall, S. Legvold, 1960 .

Matrix effects in quantitative auger analysis of dilute alloys

P. Hall, J. Morabito, 1979 .

Relative sensitivity factors for quantitative Auger analysis of binary alloys

P. Hall, J. Morabito, D. K. Conley, 1977 .

Quantitative Auger analysis of gold-copper-oxygen and gold-nickel-oxygen surfaces using relative sensitivity factors

J. M. Morabito, P. M. Hall, P. Hall, 1977 .

RESEARCH NOTE: Errors in the determination of ESR spin concentrations by numerical double integration

P. Hall, 1972 .

Electrical resistivity of yttrium and dysprosium single crystals

P. Hall, 1959 .

Right‐Angle Bends in Thin Strip Conductors

P. M. Hall, P. Hall, F. Hagedorn, 1963 .

Creep and Stress Relaxation in Solder Joints

P. Hall, Peter M. Hall, 1991 .

A formalism for determining grain boundary diffusion coefficients using surface analysis

P. Hall, J. Morabito, P. M Hall, 1976 .

Interdiffusion in the CuAu thin film system at 25°C to 250°C

J. M. Morabito, N. T. Panousis, P. M. Hall, 1977 .

Thermal and mechanical analysis of flip-chips on a liquid-cooled multichip module

Rajen Chanchani, P. M. Hall, R. Narayanan, 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

Temperature dependence of thermal expansion of ceramics and metals for electronic packages

R. Chanchani, P. Hall, P. Hall, 1990 .

Recent advances in solder bond technology for microelectronic packaging

P. Hall, J. Morabito, 1980 .

Holo-interferometric measurement of the thermal deformation response to power dissipation in multilayer printed wiring boards

Jack A. Gilbert, T. D. Dudderar, P. M. Hall, 1985 .

Thermal Expansivity and Thermal Stress in Multilayered Structures

Peter M. Hall, P. Hall, 1993 .

THE EFFECT OF EXPANSION MISMATCH ON TEMPERATURE COEFFICIENT OF RESISTANCE OF THIN FILMS

P. M. Hall, P. Hall, 1968 .

Solder Post Attachment of Ceramic Chip Carriers to Ceramic Film Integrated Circuits

P. Hall, 1981 .

Sheet‐Resistance Measurement on a Sample with a Circular Hole or on a Circular Sample

P. Hall, J. Koo, 1967 .

Reduced Gold-Plating on Copper Leads for Thermocompression Bonding-Part I: Initial Characterization

N. Panousis, N. Panousis, P. Hall, 1977 .