Nikhil M. Murdeshwar

Deformation and bonding processes in aluminum ultrasonic wire wedge bonding

J. E. Krzanowski, Nikhil M. Murdeshwar, 1990 .

A microstructural study of dislocation substructures formed in metal foil substrates during ultrasonic wire bonding

James E. Krzanowski, J. E. Krzanowski, Nikhil M. Murdeshwar, 1997 .

Partial diffusion reactions and the associated volume changes in thermally exposed Au-Al ball bonds

Kevin Ely, John C. Lippold, W. A. Baeslack, 2004 .

Phase transformations in thermally exposed Au-Al ball bonds

Kevin Ely, J. Lippold, Nikhil M. Murdeshwar, 2004 .