B. Chylak

发表

Advanced wire bond looping technology for emerging packages

J. Brunner, I. Wei Qin, B. Chylak, 2004, IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).

Developments in fine pitch copper wire bonding production

B. Chylak, 2009, 2009 11th Electronics Packaging Technology Conference.

Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding

H. Clauberg, B. Chylak, Jamin Ling, 2009 .

Wire bonding optimization with fine copper wire for volume production

Kuan Fang Lee, H. Clauberg, B. Chylak, 2010, 2010 12th Electronics Packaging Technology Conference.

Enabling high volume fine pitch copper wire bonding: Enhancements to process and equipment capability

John Foley, H. Clauberg, B. Chylak, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Wire bonding of Cu and Pd coated Cu wire: Bondability, reliability, and IMC formation

V. L. Acoff, H. Clauberg, B. Chylak, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Probing wire bond issues for bonding over Cu / low-K dielectric materials

F. Keller, B. Chylak, 2004 .

Chip-to-Chip and Chip-to-Wafer Thermocompression Flip Chip Bonding

H. Clauberg, B. Chylak, A. Rezvani, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Fine-Pitch (≤10 µm) Direct Cu-Cu Interconnects Using In-Situ Formic Acid Vapor Treatment

U. Mogera, S. Iyer, B. Chylak, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Stitch Bond Process of Pd-Coated Cu Wire: Experimental and Numerical Studies of Process Parameters and Materials

M. Mayer, J. Brunner, B. Chylak, 2013 .

Advances in Memory Die Stacking

Jie Wu, Andreas Marte, Urban Ernst, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding

Horst Clauberg, Bob Chylak, Ivy Qin, 2013 .

New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study

V. L. Acoff, H. Clauberg, B. Chylak, 2016 .

Nickel-palladium bond pads for copper wire bonding

Horst Clauberg, Bob Chylak, Petra Backus, 2011, Microelectron. Reliab..

Copper Wire Bonding: R&D to High Volume Manufacturing

Horst Clauberg, Bob Chylak, John Foley, 2012 .

Optimizing Ag wire bonding for memory devices

Bob Chylak, Basil Milton, Gary Schulze, 2017, Electronic Packaging Technology Conference.

Wire Bonding Looping Solutions for Advanced High Pin Count Devices

Bob Chylak, Basil Milton, Gary Schulze, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Advanced wire bonding technology for Ag wire

Bob Chylak, Oranna Yauw, Aashish Shah, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Advances in Wire Bonding Technology for Different Bonding Wire Material

Bob Chylak, Aashish Shah, Nelson Wong, 2015 .

Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing

V. L. Acoff, S. Song, H. Clauberg, 2012 .

Fluxless Bonding Via In-Situ Oxide Reduction

B. Chylak, A. Bajwa, Tom Colosimo, 2022, 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).

Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package

Bob Chylak, Oranna Yauw, Aashish Shah, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Evaluation of the corrosion performance of Cu-Al intermetallic compounds and the effect of Pd addition

Zhong Chen, Chee Lip Gan, Bob Chylak, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

High throughput thermo-compression bonding with pre-applied underfill for 3D memory applications

H. Clauberg, B. Chylak, O. Yauw, 2016, Electronic Packaging Technology Conference.

Development of advanced wire bonding technology for QFN devices

Bob Chylak, Ivy Qin, Alireza Rezvani, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Thermocompression flip chip bonding optimization for pre-applied underfill

H. Clauberg, B. Chylak, O. Yauw, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Wire bonding with Pd-coated copper wire

Horst Clauberg, Bob Chylak, Nelson Wong, 2010, 2010 IEEE CPMT Symposium Japan.