I. Singh

Enhancing fine pitch, high I/O devices with copper ball bonding

L. Levine, I. Singh, J. On, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Micro-bump challenges and reliability improvements in stack-die packages

R. Chaware, I. Singh, Yi-Ting Henry Chen, 2017, 2017 IEEE CPMT Symposium Japan (ICSJ).

Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing

V. L. Acoff, S. Song, H. Clauberg, 2012 .

Assembly challenges in developing 3D IC package with ultra high yield and high reliability

Ganesh Hariharan, Raghunandan Chaware, Inderjit Singh, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Reliability Evaluations on 3D IC Package beyond JEDEC

Ganesh Hariharan, Raghunandan Chaware, Inderjit Singh, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Board Level Reliability Optimization for 3D IC Packages with Extra Large Interposer

Ganesh Hariharan, Inderjit Singh, Laurene Yip, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Assembly process qualification and reliability evaluations for heterogeneous 2.5D FPGA with HiCTE Ceramic

Ganesh Hariharan, Raghunandan Chaware, Inderjit Singh, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.