B. Appelt
发表
Y. Lai,
B. Appelt,
William T. Chen,
2010,
2010 IEEE CPMT Symposium Japan.
Y. Lai,
B. Appelt,
A. Tseng,
2010,
3rd Electronics System Integration Technology Conference ESTC.
Y. Lai,
B. Appelt,
Louie Huang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
B. Appelt,
J. Gotro,
K. I. Papathomas,
1987
.
B. Appelt,
M. Hung,
Harrison Chung,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
B. Appelt,
G. Meyerhoff,
1980
.
B. Appelt,
G. Meyerhoff,
1979
.
B. Appelt,
M. Abadie,
1989,
Dental materials : official publication of the Academy of Dental Materials.
B. Appelt,
M. Abadie,
1988
.
B. Appelt,
M. Abadie,
1985
.
R. Porter,
B. Appelt,
1981
.
B. K. Appelt,
Y. Lai,
C. Kao,
2011,
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
B. Appelt,
A. Tseng,
Louie Huang,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
Y. Lai,
B. Appelt,
A. Tseng,
2011,
18th European Microelectronics & Packaging Conference.
Bernd K. Appelt,
B. Appelt,
2009
.
R. Porter,
B. Appelt,
Li-hui,
1981
.
Chun-Hsiung Chen,
Yi-Shao Lai,
Andy Tseng,
2011,
Microelectron. Reliab..
Y. Lai,
B. Appelt,
A. Tseng,
2010,
2010 12th Electronics Packaging Technology Conference.
Yi-Shao Lai,
Andy Tseng,
Bernd K. Appelt,
2009,
2009 11th Electronics Packaging Technology Conference.
Y. Lai,
M. Shih,
B. Appelt,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
D. Söll,
L. Cooley,
D. Soll,
1982,
Proceedings of the National Academy of Sciences of the United States of America.
Bernd K. Appelt,
B. Appelt,
J. Gotro,
1986
.
D. Seraphim,
L. Lee,
B. Appelt,
1984
.