G.Q. Zhang
发表
W. V. van Driel,
C. Yuan,
E. Spaan,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
W. V. van Driel,
G.Q. Zhang,
J. Janssen,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
O. van der Sluis,
W. V. van Driel,
G.Q. Zhang,
2008,
2008 58th Electronic Components and Technology Conference.
W. V. van Driel,
G.Q. Zhang,
M. van Gils,
2005,
2005 6th International Conference on Electronic Packaging Technology.
W. V. van Driel,
F. Sun,
G.Q. Zhang,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
J. F. Creemer,
P. Sarro,
W. V. van Driel,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
W. V. van Driel,
G.Q. Zhang,
J. Zaal,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
W. V. van Driel,
G.Q. Zhang,
R. van Silfhout,
2006,
56th Electronic Components and Technology Conference 2006.
W. V. van Driel,
J. V. van Beek,
G.Q. Zhang,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
K. Jansen,
G.Q. Zhang,
L. Ernst,
2006,
2006 7th International Conference on Electronic Packaging Technology.
M. Cherkaoui,
O. van der Sluis,
W. V. van Driel,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
W. V. van Driel,
F. Sun,
G.Q. Zhang,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
M. Bartek,
K. Jansen,
G.Q. Zhang,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
M. Bartek,
K. Jansen,
G.Q. Zhang,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
Ming Yan,
X. Zhang,
G.Q. Zhang,
2019,
Journal of Alloys and Compounds.
Lei Liu,
Fengze Hou,
G.Q. Zhang,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
C. Yang,
W. Zhang,
K. Prashanth,
2020,
Journal of Alloys and Compounds.
M. van Soestbergen,
G.Q. Zhang,
L. Ernst,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
M. van Soestbergen,
G.Q. Zhang,
L. Ernst,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
M. van Soestbergen,
G.Q. Zhang,
L. Ernst,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
Y. Li,
G. Tao,
W. V. van Driel,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
O. van der Sluis,
D.G. Yang,
G.Q. Zhang,
2007,
2007 8th International Conference on Electronic Packaging Technology.
O. van der Sluis,
W. V. van Driel,
D.G. Yang,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
O. van der Sluis,
W. V. van Driel,
D.G. Yang,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
W. V. van Driel,
C. Yuan,
D.G. Yang,
2006,
2006 7th International Conference on Electronic Packaging Technology.
W. V. van Driel,
G.Q. Zhang,
R. van Silfhout,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
R. Tummala,
A. Saxena,
W. V. van Driel,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
J. Beijer,
G.Q. Zhang,
L. Ernst,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
J. Beijer,
G.Q. Zhang,
L. Ernst,
2003,
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
O. van der Sluis,
G.Q. Zhang,
J. Janssen,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
W. V. van Driel,
G.Q. Zhang,
L. Ernst,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Lei Liu,
Fengze Hou,
Yang Hai,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Xiupeng Li,
Jianlin Huang,
Dušan S Golubović,
2015,
Optics express.
C. Yang,
Y. Hu,
W. Zhang,
2018,
Materials Science and Engineering: A.
G.Q. Zhang,
C. Xu,
W. Feng,
2012
.
W.D. van Driel,
G.Q. Zhang,
R.A.B. Engelen,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
W.D. van Driel,
G.Q. Zhang,
R.A.B. Engelen,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
O. van der Sluis,
G.Q. Zhang,
P. Timmermans,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
G.Q. Zhang,
G.Q. Zhang,
L. Ernst,
2003,
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
W.D. van Driel,
G.Q. Zhang,
W. V. van Driel,
2003,
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
C. J. Liu,
Guoqi Zhang,
G.Q. Zhang,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
G. Q. Zhang,
L. J. Ernst,
A.A.O. Tay,
2000,
Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).
W.D. van Driel,
Xuejun Fan,
G.Q. Zhang,
2008,
IEEE Transactions on Components and Packaging Technologies.
A.A.O. Tay,
Leo J. Ernst,
J. Janssen,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
W.D. van Driel,
G.Q. Zhang,
J.J.M. Zaal,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
M. Geers,
P. Schreurs,
G.Q. Zhang,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
K.M.B. Jansen,
G.Q. Zhang,
Xuejun Fan,
2004,
IEEE Transactions on Components and Packaging Technologies.
D.G. Yang,
G.Q. Zhang,
H.J.L. Bressers,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
E. Beyne,
B. Vandevelde,
M. Gonzalez,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
D.G. Yang,
G.Q. Zhang,
W. van Driel,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
K.M.B. Jansen,
G.Q. Zhang,
H.J.L. Bressers,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
O. van der Sluis,
W. V. van Driel,
K. Jansen,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
W.D. van Driel,
D.G. Yang,
G.Q. Zhang,
2005,
2005 6th International Conference on Electronic Packaging Technology.
W. V. van Driel,
K. Jansen,
D.G. Yang,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
W.D. van Driel,
K.M.B. Jansen,
D.G. Yang,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
W.D. van Driel,
K.M.B. Jansen,
D.G. Yang,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
K. Jansen,
D.G. Yang,
G.Q. Zhang,
2003,
Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..
H. Sadeghian,
G.Q. Zhang,
R. Poelma,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
H. Sadeghian,
S. Koh,
G.Q. Zhang,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
R.H.J. Peerlings,
G.Q. Zhang,
R. Peerlings,
2005,
2005 6th International Conference on Electronic Packaging Technology.
G.Q. Zhang,
L. Ernst,
H. Li,
2006
.
S. Koh,
G.Q. Zhang,
W. V. van Driel,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
W.D. van Driel,
Xuejun Fan,
G.Q. Zhang,
2008,
IEEE Transactions on Components and Packaging Technologies.
W.D. van Driel,
D.G. Yang,
G.Q. Zhang,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
W. V. van Driel,
G.Q. Zhang,
J. Janssen,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
W. V. van Driel,
G.Q. Zhang,
H. Scholten,
2023,
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Fengze Hou,
G.Q. Zhang,
Daoguo Yang,
2011,
2011 12th International Conference on Electronic Packaging Technology and High Density Packaging.
W.D. van Driel,
S. Koh,
G.Q. Zhang,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
N. Tzannetakis,
G.Q. Zhang,
A. Wymyslowski,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
W.D. van Driel,
K.M.B. Jansen,
D.G. Yang,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
K.M.B. Jansen,
D.G. Yang,
G.Q. Zhang,
2004,
5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the.
Xuejun Fan,
G.Q. Zhang,
W. van Driel,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
G. K. Ntinas,
Chao Zong,
X. Shen,
2013
.
Feng Li,
Rong Shi,
G. Q. Zhang,
2007
.
G.Q. Zhang,
L. Ernst,
Y. He,
2005
.
G.Q. Zhang,
L. Ernst,
Y.T. He,
2004
.
E. Bakkers,
A. W. Dawotola,
W. V. van Driel,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
M. S. Kiasat,
D.G. Yang,
G.Q. Zhang,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).