C. Yong

Process optimization approach in fine pitch Cu wire bonding

B. K. Wong, C. Yong, P. Eu, 2011, 2011 International Conference on Electronic Devices, Systems and Applications (ICEDSA).

High temperature automotive application: A study on fine pitch Au and Cu WB integrity vs. Ni thickness of Ni/Pd/Au bond pad on C90 low k wafer technology

V. Mathew, E. P. Leng, C. Yong, 2010, 2010 12th Electronics Packaging Technology Conference.

A thermal aging study on both Au-Cu and Au-Al wire-bonded interfaces

C. Lee, T. Tran, C. Yong, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Shape deterioration of mesa structures in post-CMOS anisotropic etching of silicon microsensors: an experimental study

Makoto Ishida, Hidekuni Takao, K. Rajanna, 2000 .