L. C. Wai
发表
Tan Juan Boon,
L. C. Wai,
N. Jaafar,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
R. Balamurugan,
A. Sundarrajan,
Junqi Wei,
2016,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
F. Che,
T. Chai,
L. C. Wai,
2018,
IEEE Transactions on Device and Materials Reliability.
F. Che,
T. Chai,
L. C. Wai,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Xiaowu Zhang,
F. Che,
T. Chai,
2015,
Journal of Electronic Materials.
Xiaowu Zhang,
F. Che,
T. Chai,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Xiaowu Zhang,
Tai Chong Chai,
Leong Ching Wai,
2012,
Microelectron. Reliab..
T. Chai,
L. C. Wai,
D. Vallett,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
G. Tang,
L. C. Wai,
Xiao Wu Zhang,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
T. Lim,
Xiaowu Zhang,
G. Tang,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
T. Lim,
Xiaowu Zhang,
Zhaohui Chen,
2018,
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC).
L. Lim,
L. C. Wai,
Qingxin Zhang,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
G. Tang,
L. C. Wai,
M. Ding,
2017,
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Min Woo Daniel Rhee,
V. S. Rao,
L. C. Wai,
2012,
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
John H. Lau,
Xiaowu Zhang,
Vempati Srinivasa Rao,
2010,
Microelectron. Reliab..
Development of a Novel Lead Frame Based Double Side Liquid Cooling High Performance SiC Power Module
Xiaowu Zhang,
G. Tang,
L. C. Wai,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).