D. Witarsa

Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy

Tan Juan Boon, L. C. Wai, N. Jaafar, 2011, 2011 IEEE 13th Electronics Packaging Technology Conference.

Bed of nails: fine pitch wafer-level packaging interconnects for high performance nano devices

A.A.O. Tay, Vempati Srinivasa Rao, V. Kripesh, 2005, 2005 7th Electronic Packaging Technology Conference.

Reliability studies of a through via silicon stacked module for 3D microsystem packaging

Seung Wook Yoon, A.G.K. Viswanath, D. Witarsa, 2006, 56th Electronic Components and Technology Conference 2006.