J. Woo
发表
Tan Juan Boon,
L. C. Wai,
N. Jaafar,
2011,
2011 IEEE 13th Electronics Packaging Technology Conference.
M. Bosman,
J. Woo,
L.J. Tang,
2010,
2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
L. Tang,
J. Woo,
L. Wong,
2016,
Electronic Packaging Technology Conference.