J. Schelen

Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

J. Tang, E. Reinders, C. T. A. Revenberg, 2012, 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).

Flexible system for real-time plasma decapsulation of copper wire bonded IC packages

J. Tang, J. Schelen, C. Beenakker, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

A temperature oscillation instrument to determine pyroelectric properties of materials at low frequencies: Towards elimination of lock-in methods.

S. van der Zwaag, H. Khanbareh, W. Groen, 2015, The Review of scientific instruments.

Process control in plasma decapsulation: Preventing damage to the copper wire bonds & controlled removal of Si3N4 passivation layer

J. Schelen, C. Beenakker, J. Tang, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.

Fast Etching of Molding Compound by an Ar/O2/CF4 Plasma and Process Improvements for Semiconductor Package Decapsulation

C. Beenakker, J. Schelen, C. Beenakker, 2012 .

Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

E. Reinders, C. T. A. Revenberg, J. Schelen, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Optimization of the Microwave Induced Plasma system for failure analysis in integrated circuit packaging

J. Schelen, C. Beenakker, J. Tang, 2010, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.

Flexible Piezoelectric Touch Sensor by Alignment of Lead‐Free Alkaline Niobate Microcubes in PDMS

D. D. de Leeuw, S. van der Zwaag, D. B. Deutz, 2017 .