F. Mu
发表
Haiyan Zhao,
Xin Wu,
F. Mu,
2018,
Molecules.
T. Suga,
F. Mu,
Yinghui Wang,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2017,
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2016
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2016
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2015
.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2014,
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
Dapeng Chen,
Weibing Wang,
2019,
Micromachines.
T. Suga,
Dapeng Chen,
Weibing Wang,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
A. Iacopi,
L. Hold,
T. Suga,
2018,
physica status solidi (a).
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2015,
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
T. Suga,
F. Mu,
A. Yamauchi,
2021
.
T. Suga,
M. Uomoto,
T. Shimatsu,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
T. Suga,
Yoshikazu Takahashi,
E. Higurashi,
2019,
Applied Surface Science.
T. Suga,
S. Graham,
Luke Yates,
2019,
ACS applied materials & interfaces.
A. Wu,
G. Zou,
Jia-lie Ren,
2010
.
A. Wu,
G. Zou,
Y. Zhou,
2013
.
Sen Huang,
Xinyu Liu,
Xinhua Wang,
2021
.
T. Suga,
J. Shiomi,
Xinyu Liu,
2021,
Journal of Alloys and Compounds.
T. Suga,
T. You,
D. Cahill,
2021,
2103.08084.
T. Suga,
T. You,
M. Goorsky,
2020,
ACS applied materials & interfaces.
T. Suga,
Yoshikazu Takahashi,
F. Mu,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
T. Suga,
Dapeng Chen,
X. Ou,
2019,
Ceramics International.
T. Suga,
F. Mu,
K. Takeuchi,
2021,
Advanced Materials Interfaces.
T. Suga,
F. Mu,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
T. Suga,
F. Mu,
M. Fujino,
2017
.
T. Suga,
T. You,
G. Han,
2021,
ACS Applied Electronic Materials.
T. You,
Shumin Wang,
Kai Huang,
2020,
APL Materials.
Y. Liu,
Y. Hao,
T. Suga,
2020,
Journal of Physics D: Applied Physics.
T. Suga,
R. He,
F. Mu,
2018,
Materialia.
T. Suga,
M. Uomoto,
T. Shimatsu,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
F. Mu,
Yinghui Wang,
2020,
Metals.
D. Olson,
Stephen Liu,
Zhenzhen Yu,
2021,
npj Materials Degradation.
Z. Lin,
F. Mu,
X. Wu,
2021
.
T. Suga,
F. Mu,
2020,
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
T. Suga,
R. He,
F. Mu,
2018,
Scripta Materialia.
T. Suga,
F. Mu,
H. Nakazawa,
2017
.
Xinyu Liu,
Sen Huang,
Dahai Wang,
2022,
Materials.
Jie Zhou,
T. Suga,
T. You,
2022,
ACS omega.
Y. Hao,
T. Suga,
T. You,
2020,
Science China Physics, Mechanics & Astronomy.
Y. Hao,
T. Suga,
T. You,
2019,
2019 IEEE International Electron Devices Meeting (IEDM).
T. Suga,
T. You,
Yi Hao,
2021,
Fundamental Research.
T. Suga,
T. You,
D. Cahill,
2021,
ACS applied materials & interfaces.
T. Suga,
J. Shiomi,
Jingjing Shi,
2019,
ACS applied materials & interfaces.
Haiyan Zhao,
Xin Wu,
F. Mu,
2018,
Computational Materials Science.
T. Suga,
F. Mu,
K. Takeuchi,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Ke Xu,
T. You,
Hao Huang,
2020,
Semiconductor Science and Technology.
Haiyan Zhao,
Xin Wu,
F. Mu,
2020
.
T. Suga,
F. Mu,
H. Nakazawa,
2016
.
T. Suga,
J. Shiomi,
Jingjing Shi,
2019,
ACS applied materials & interfaces.
T. Suga,
M. Schneider-Ramelow,
F. Mu,
2023,
Micromachines.
T. Suga,
G. Zou,
Hui Ren,
2019,
AIP Advances.
A. Iacopi,
L. Hold,
B. Wood,
2017,
ACS applied materials & interfaces.
Wenhui Ma,
F. Mu,
Minpeng Lei,
2023,
Crystal Growth & Design.
T. Suga,
Xinyu Liu,
Sen Huang,
2021,
Journal of Materials Science: Materials in Electronics.
T. Suga,
F. Mu,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).