Yinghui Wang
发表
Haiyan Zhao,
Xin Wu,
F. Mu,
2018,
Molecules.
T. Suga,
F. Mu,
Yinghui Wang,
2019,
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
Yinghui Wang,
Jian Lu,
2010,
2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP).
T. Suga,
Yinghui Wang,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
T. Suga,
Yinghui Wang,
Jian Lu,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
T. Suga,
Yinghui Wang,
2008,
2008 58th Electronic Components and Technology Conference.
T. Suga,
M. Howlader,
E. Higurashi,
2005,
2005 6th International Conference on Electronic Packaging Technology.
T. Suga,
Dapeng Chen,
Weibing Wang,
2019,
Micromachines.
T. Suga,
Dapeng Chen,
Weibing Wang,
2018,
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Tadatomo Suga,
T. Suga,
Yinghui Wang,
2008
.
T. Suga,
E. Higurashi,
Ming Li,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
T. Suga,
Takashi Kimura,
K. Nishida,
2007
.
T. Suga,
Yoshikazu Takahashi,
E. Higurashi,
2019,
Applied Surface Science.
Molin Li,
Weibing Wang,
Yinghui Wang,
2018,
2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS).
T. Suga,
Dapeng Chen,
X. Ou,
2019,
Ceramics International.
T. Suga,
Yinghui Wang,
2010,
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
T. Suga,
Yinghui Wang,
M. Fujino,
2008,
2008 IEEE 9th VLSI Packaging Workshop of Japan.
Dapeng Chen,
Yinghui Wang,
Yang Xu,
2018
.
Shengkai Wang,
Dapeng Chen,
Yinghui Wang,
2017,
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
R. He,
F. Mu,
2018,
Materialia.
T. Suga,
F. Mu,
Yinghui Wang,
2020,
Metals.
T. Suga,
Jian Cai,
Yinghui Wang,
2014,
2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
T. Suga,
Yinghui Wang,
2007,
2007 8th International Conference on Electronic Packaging Technology.
T. Suga,
Yinghui Wang,
2013,
2013 3rd IEEE CPMT Symposium Japan.
Tadatomo Suga,
Matiar M. R. Howlader,
Takashi Kimura,
2005
.
Weibing Wang,
Yinghui Wang,
Haiping Shang,
2019,
2019 International Conference on Electronics Packaging (ICEP).
Haiyan Zhao,
Xin Wu,
F. Mu,
2018,
Computational Materials Science.
T. Suga,
Yinghui Wang,
Junlong Li,
2021,
Micromachines.
T. Suga,
E. Higurashi,
Ming Li,
2012,
2012 2nd IEEE CPMT Symposium Japan.
Molin Li,
Weibing Wang,
Yinghui Wang,
2018,
Micro & Nano Letters.
T. Suga,
Yinghui Wang,
Junlong Li,
2021,
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
T. Suga,
Yinghui Wang,
Junlong Li,
2021
.
Shengkai Wang,
Dapeng Chen,
Yang Xu,
2020
.
T. Suga,
Yinghui Wang,
Chenxi Wang,
2009
.
Takahiro Sato,
T. Suga,
T. Sugiura,
2008
.