M. Felczak

发表

Exact solution for optimal placement of electronic components on linear array using analytical thermal wake function

G. Mey, B. Więcek, M. Felczak, 2008 .

THE USE OF FRACTIONAL CALCULUS FOR THE OPTIMAL PLACEMENT OF ELECTRONIC COMPONENTS ON A LINEAR ARRAY

G. Mey, M. Felczak, 2015 .

TH USE OF FRACTION L A CULUS FOR THE OPTIMAL PLACEMENT OF ELECTRONIC C MPONENTS ON A LINEAR RRAY

G. Mey, Ey, B. Więcek, 2014 .

Convection and radiation cooling of overhead power lines - laboratory verification using thermography

G. Mey, B. Więcek, M. Felczak, 2017 .

Analysis and design of electronic device cooling system elements in forced convection conditions

M. Felczak, 2008 .

Lateral and Perpendicular Thermal Conductivity Measurement on Textile Double Layers

M. Michalak, G. Mey, B. Więcek, 2015 .

Dynamic thermal heat pipes analysis: Thermal impedance in start-up condition

Vasilis Chatziathanasiou, Gilbert De Mey, Mariusz Felczak, 2019, Microelectron. J..

Application of genetic algorithms for electronic devices placement in structures with heat conduction through the substrate

M. Felczak, B. Więcek, B. Więcek, 2011, Microelectron. Reliab..

Application of genetic algorithms for electronic devices placement

Boguslaw Wiecek, M. Felczak, B. Więcek, 2008 .

Optimal Placement of Eletronic Devices in Forced Convective Cooling Conditions

Gilbert De Mey, Mariusz Felczak, Boguslaw Wiecek, 2007, 2007 14th International Conference on Mixed Design of Integrated Circuits and Systems.

Evaluation of the Thermal Parameters of Textile Materials Using the Thermographic Method

M. Michalak, B. Więcek, M. Felczak, 2009 .

Modelling and IR measurement of the electronic substrate thermal conductivity

Gilbert De Mey, Mariusz Felczak, Boguslaw Wiecek, 2015, Microelectron. Reliab..