Van D Thourhout

发表

Adhesive Bonding of InP ∕ InGaAsP Dies to Processed Silicon-On-Insulator Wafers using DVS-bis-Benzocyclobutene

M. Smit, R. Nötzel, G. Roelkens, 2006 .

Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

van Pj René Veldhoven, S. Stankovic, G. Roelkens, 2013 .

In-band label extractor based on cascaded si ring resonators enabling 160 Gb / s optical packet switching modules

D. Lucente, Van D Thourhout, 2014 .

A photonic interconnect layer on CMOS

Philippe Regreny, Mk Meint Smit, Xjm Xaveer Leijtens, 2007 .

Light emission and enhanced nonlinearity in nanophotonic waveguide circuits by III–V/silicon-on-insulator heterogeneous integration

Isabelle Sagnes, Gunther Roelkens, Grégoire Beaudoin, 2008 .

Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components

Mk Meint Smit, Gunther Roelkens, Ilse Christiaens, 2005 .

InP-based membrane photodetector for optical interconnections on CMOS ICs

de T Tjibbe Vries, M. Smit, R. Nötzel, 2007 .

An optical interconnect layer on silicon

de T Tjibbe Vries, M. Smit, R. Nötzel, 2007 .

Laser emission and photodetection in an InP/InGaAsP layer integrated on and coupled to a Silicon-on-Insulator waveguide circuit.

R Baets, D Van Thourhout, M. Smit, 2006, Optics express.

III-V-on-silicon multi-frequency lasers.

de T Tjibbe Vries, E. J. Geluk, G. Duan, 2013, Optics express.