D. Goyal

发表

Failure mechanism of brittle solder joint fracture in the presence of electroless nickel immersion gold (ENIG) interface

D. Goyal, T. Lane, P. Kinzie, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

3D Microelectronic Packaging

D. Goyal, Yan Li, 2021, Springer Series in Advanced Microelectronics.

Detection and characterization of defects in microelectronic packages and boards by means of high-resolution x-ray computed tomography (CT)

Mario Pacheco, D. Goyal, Deepak Goyal, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

High resolution and fast throughput-time X-ray computed tomography for semiconductor packaging applications

J. Elmer, D. Parkinson, H. Barth, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

Advanced in situ characterization of TIM1 reliability

P. Li, D. Goyal, Yongmei Liu, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Fault Isolation and Failure Analysis of 3D Packaging

D. Goyal, Yan Li, 2020, 3D Microelectronic Packaging.

Lead-Free Solder Joint Void Evolution During Multiple Subsequent High-Temperature Reflows

J. Moore, B. Pathangey, D. Goyal, 2012, IEEE Transactions on Device and Materials Reliability.

Advances in 3D Interconnect Characterization Techniques for Fault Isolation and Defect Imaging

F. Wellstood, W. Yun, A. Orozco, 2016 .

Methodology and Challenges in Characterization of 3D Package Interconnection Materials and Processes

Deepak Goyal, Rajen Dias, D. Goyal, 2016 .

The Mechanism of Dense Interfacial Voids and Its Impact on Solder Joint Reliability

B. Pathangey, D. Goyal, Pilin Liu, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Effect of package design and layout on BGA solder joint reliability of an organic C4 package

Deepak Goyal, Biju Chandran, J. Thomas, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Analytical challenges in next generation packaging/assembly

Deepak Goyal, Rajen Dias, Shalabh Tandon, 1998 .

Failure Mechanism and Kinetics Studies of Electroless Ni-P Dissolution in Pb-Free Solder Joints under Electromigration

Alan Overson, D. Goyal, Pilin Liu, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Key parameters for fast Ni dissolution during electromigration of Sn0.7Cu solder joint

Alan Overson, D. Goyal, Pilin Liu, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

A Comparison Study of Cu Dissolution Mechanism and Kinetics in Solder Joints under Electromigration and Extended Reflow

Alan Overson, D. Goyal, Pilin Liu, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Electromigration induced interfacial microstructure evolution of solder joints in electronic packaging

Alan Overson, D. Goyal, Pilin Liu, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

IEEE COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY SOCIETY

Cemal Basaran, Flavio Canavero, Ephraim Suhir, 2010 .

Fault Isolation Using Time Domain Reflectometry, Electro Optical Terahertz Pulse Reflectometry and Time Domain Transmissometry

Hemachandar Tanukonda Devarajulu, D. Goyal, Mayue Xie, 2019, Microelectronics Failure Analysis.

Comparison of Laser Cladding And Thermal Spraying Techniques Used For Wear Control

D. Goyal, Sarpreet Singh, P. Garg, 2017 .

A Review of Failure Analysis Methods for Advanced 3D Microelectronic Packages

Yan Li, Purushotham Kaushik Muthur Srinath, Deepak Goyal, 2015, Journal of Electronic Materials.

Introduction to 3D Microelectronic Packaging

Deepak Goyal, Yan Li, D. Goyal, 2020, 3D Microelectronic Packaging.

Investigation of Multiple Heat Source Effects in Lock-In Thermography Applications in Semiconductor Packages

Deepak Goyal, Bharath Viswanath Ravi, Mayue Xie, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Applications of terahertz technology in the semiconductor industry

Y. Cai, D. Goyal, Z. Wang, 2013 .

Effect of Interaction Between Multiple Defects on Z-Depth Estimate in Lock-in Thermography Applications

Deepak Goyal, Bharath Viswanath Ravi, Mayue Xie, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Improving Terahertz Signal Travel Distance for Fault Isolation

Deepak Goyal, Mayue Xie, Hemachandar Tanukonda Devarajulu, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

Innovations in Fault Isolation Methods for 3D Packages with 10X Improvement in Accuracy

Deepak Goyal, Mayue Xie, Tom Begala, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).