C.M.L. Wu
发表
C. L. Wu,
D. Q. Yu,
C. Law,
2002
.
N. Zhao,
C.M.L. Wu,
Z. Chang,
2020
.
N. Zhao,
C.M.L. Wu,
Z. Chang,
2020
.
N. H. Yeung,
Johan Liu,
C.M.L. Wu,
2001
.
C.M.L. Wu,
M. Huang,
M.L. Huang,
2005,
IEEE Transactions on Advanced Packaging.
Y. Chan,
J. Lai,
C. L. Wu,
2000
.
Y. Chan,
J. Lai,
C. L. Wu,
2000
.
J. Lai,
M. Huang,
C.M.L. Wu,
2000
.
C.M.L. Wu,
1987
.
C. Law,
C.M.L. Wu,
2004,
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).
J. Lai,
C.M.L. Wu,
Yong-li Wu,
1997
.
Y. W. Wong,
C.M.L. Wu,
K.L. Li,
2006,
2006 International Conference on Electronic Materials and Packaging.
C. L. Wu,
Mingliang L. Huang,
C.M.L. Wu,
2005
.
J. Lai,
C. L. Wu,
D. Q. Yu,
2006
.
C. L. Wu,
D. Q. Yu,
C. Law,
2002
.
Y. Mai,
S. Bai,
R. Li,
2002
.
Mingliang L. Huang,
C.M.L. Wu,
Chi Man Wu,
2002
.
R. Li,
T. Wong,
C.M.L. Wu,
1997
.
Haoran Ma,
N. Zhao,
C.M.L. Wu,
2020,
Materials Today Communications.
B. An,
C.M.L. Wu,
2007,
2007 8th International Conference on Electronic Packaging Technology.
C.M.L. Wu,
C.M.L Wu,
1990
.
D. Chi,
C. Law,
C.M.L. Wu,
2005,
IEEE Transactions on Advanced Packaging.
C.M.L. Wu,
2002,
The Fourth International Conference on Advanced Semiconductor Devices and Microsystem.
C. Law,
C.M.L. Wu,
2004,
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).
N. H. Yeung,
J. Liu,
C.M.L. Wu,
2000,
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).