J. Jang

发表

Pb-free solders for flip-chip interconnects

D. Frear, J. Jang, J. K. Lin, 2001 .

Crystallization of electroless Ni-P under bump metallization induced by solder reaction

D. Frear, K. Tu, J. Jang, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Inclusion effects on submerged-arc weld microstructure

J. Indacochea, J. Jang, 1987 .

Low-firing and microwave dielectric properties of Ba[(Ni0.6Zn0.4)0 .33Nb0.67]O3 ceramics doped with Sb2O5 and B2O3

J. Lee, Y. Jang, J. Jang, 1999 .

Strain and magnetic anisotropy of epitaxial Ni∕Cu(001) nanostructures

Sung-chul Shin, Hangil Lee, J. Jang, 2006 .

Wear behavior of martensite and ferrite in high chromium steel balls in wet grinding and implication to flotation

I. Iwasaki, J. Jang, J. Moore, 1989 .

Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints

D. Frear, K. Tu, A. Mal, 2000 .

High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films

K. Tu, J. Jang, P. Kim, 1999 .

Solubility effect of CH 3 CHO and its mediated electrochemical oxidation in micellar composite solution : An electro-reactor study

G. Muthuraman, J. Jang, I. Moon, 2011 .

Direct and simultaneous determination of Co and Cu on a silicon wafer using a chemiluminescence system.

H. B. Lim, J. Jang, Y. Sung, 2011, The Analyst.

High-lead flip chip bump cracking on the thin organic substrate in a module package

L. Li, D. R. Frear, J. W. Jang, 2012, Microelectron. Reliab..

Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils

K. Tu, T. Lee, J. Jang, 1999 .

Kinetic analysis of interfacial diffusion accompanied by intermetallic compound formation

D. Frear, K. Tu, J. Jang, 1999 .

Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology

D. R. Frear, P. Thompson, King-Ning Tu, 1999 .

The Effect of Galvanic Interaction Between Martensite and Ferrite in Grinding Media Wear

J. Jang, J. Moore, I. Iwasaki, 1989 .

Corrosion behavior in a 3.5 wt% NaCl solution of amorphous coatings prepared through plasma-spray and cold-spray coating processes

J. Jang, H. Lee, S. Yi, 2014, Metals and Materials International.

Effect of martensite and austenite on grinding media wear

J. Jang, J. Moore, I. Iwasaki, 1988 .

CORROSION INVESTIGATION OF REINFORCING BARS IN PAVEMENTS AND BRIDGE DECKS. PART II: CHLORIDE PENETRATION/REBAR CORROSION MECHANISMS. FINAL REPORT

J. Jang, I. Iwasaki, 1991 .

Microstructure evolution and acceleration factor (AF) of micro-solder bumps in through-silicon-via (TSV) in high temperature storage (HTS) conditions

H. Son, S.H. Hyun, J. Son, 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

VISUALIZATION OF CHLORIDE DISTRIBUTION IN CONCRETE (ABRIDGMENT)

J W Jang, I Iwasaki, J. Jang, 1991 .