J. Clech
发表
J. Clech,
2004
.
J. Clech,
2007
.
Jean-Paul Clech,
J. Clech,
2002
.
Jean-Paul M. Clech,
J. Clech,
2002
.
J. Clech,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
J. Augis,
J. Clech,
F. Langerman,
1990,
40th Conference Proceedings on Electronic Components and Technology.
Richard J. Coyle,
Babak Arfaei,
Jean-Paul M. Clech,
2018,
JOM.
J.-P.M. Clech,
J. C. Manock,
J. Augis,
1993,
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).
Reliability figures of merit for surface-soldered leadless chip carriers compared to leaded packages
J. Augis,
J. Clech,
W. Englemaier,
1989,
Proceedings., 39th Electronic Components Conference.
Jean-Paul Clech,
J. Clech,
1997
.
J.-P.M. Clech,
J. C. Manock,
D. M. Noctor,
1994,
1994 Proceedings. 44th Electronic Components and Technology Conference.
Chrys Shea,
Takeshi Saito,
Takashi Kikuchi,
2010
.
J-P M. Clech,
J. A. Augis,
J. Augis,
1991
.
Leon M Keer,
Jack Lewis,
J. P. Clech,
1986
.
R. Coyle,
J. Clech,
B. Arfaei,
2018,
JOM.
J. Lewis,
L. Keer,
J. Clech,
1984,
Journal of biomechanical engineering.
J L Lewis,
J. Lewis,
L. Keer,
1985,
Journal of biomechanical engineering.
L. Keer,
Jack L. Lewis,
J. Clech,
1986
.