M. Rollig
发表
Low-cycle Fatigue of Ag-Based Solders Dependent on Alloying Composition and Thermal Cycle Conditions
B. Michel,
R. Dudek,
W. Faust,
2007,
2007 9th Electronics Packaging Technology Conference.
S. Rzepka,
K. Wolter,
S. Wiese,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
R. Dudek,
S. Rzepka,
M. Rollig,
2008,
2008 International Conference on Electronic Packaging Technology & High Density Packaging.
S. Wiese,
K.-J. Wolter,
M. Rollig,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
K. Wolter,
M. Krause,
M. Petzold,
2006,
EuroSime 2006 - 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems.
S. Wiese,
K.-J. Wolter,
K. Meier,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
S. Wiese,
K.-J. Wolter,
K. Meier,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.