A. Skipor

Mechanical characterization of plastic ball grid array package flexure using moire interferometry

N. Sottos, E. A. Stout, A. Skipor, 2000 .

On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder

S. V. Harren, John Botsis, J. Botsis, 1996 .

Thermal Cycling of Temperature and Strain Rate Dependent Solder Joints

S. Harren, A. Skipor, 1998 .

Mechanical bending fatigue reliability and its application to area array packaging

A. Skipor, A. Skipor, L. Leicht, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Mechanical Cycling Fatigue of PBGA Package Interconnects Mechanical Cycling Fatigue of PBGA Package Interconnects

A. Skipor, L. Leicht, 1999 .

Mechanical cycling fatigue of PBGA package interconnects

Larry Leicht, A. Skipor, A. Skipor, 2000 .

The effect of mechanical constraint on the flow and fracture of 63/37 Sn/Pb eutectic alloy

S. V. Harren, John Botsis, J. Botsis, 1995 .

Encapsulation Of Flip Chip Structures

A. Skipor, K. Moore, S. Machuga, 1992, Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium.

Stiffness properties and geometry of lumbar spine posterior elements.

A B Schultz, J A Miller, A. Schultz, 1985, Journal of biomechanics.

Mechanical bend fatigue reliability of lead-free PBGA assemblies

K. Jonnalagadda, M. Patel, A. Skipor, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).