Ming Li
发表
K. Lee,
S. Mhaisalkar,
Ming Li,
2002
.
J. Lau,
Qinglong Zhang,
Ming Li,
2015,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
J. Lau,
C. Ko,
2017
.
N. Lee,
J. Lau,
C. Ko,
2017,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
John H. Lau,
Ming Li,
Cao Xi,
2017
.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
S. Lee,
Ming Li,
Xingjia Huang,
2004,
IEEE Transactions on Electronics Packaging Manufacturing.
N. Lee,
J. Lau,
J. Lo,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
W. T. Chen,
Ming Li,
S. Mhaisalkar,
2001,
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
J. Lau,
Qinglong Zhang,
Ming Li,
2015,
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Dewen Tian,
Ming Li,
Janardhanan Pillai Madkumar,
2013,
2013 14th International Conference on Electronic Packaging Technology.
C. Ko,
R. Beica,
J. Lau,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
J. Lau,
C. Ko,
R. Beica,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Chiu Cheng-Hsin,
Z. Fan,
Ming Li,
2000,
International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).
C. Chum,
Zhong Chen,
B. Balakrisnan,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
Fan Zhang,
B. Balakrisnan,
William T. Chen,
2002
.
S. Lee,
Ming Li,
Xingjia Huang,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
C. Chum,
Fan Zhang,
Ming Li,
2002,
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
W. T. Chen,
Fan Zhang,
Ming Li,
2003
.
J. Lau,
J. Lo,
C. Ko,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
J. Knickerbocker,
S. Skordas,
D. Mcherron,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
J. Lau,
Ming Li,
J. Huang,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
J. Lau,
Ming Li,
Y. Cheung,
2015,
Electronic Components and Technology Conference.
Ming Li,
Y. Cheung,
Lei Yang,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
Ming Li,
M. Wan,
N. Lam,
2013,
2013 14th International Conference on Electronic Packaging Technology.
J. Lau,
Ming Li,
J. Huang,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
J. Lau,
J. Lo,
C. Ko,
2019,
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
J. Lau,
Li Zhang,
K. Tan,
2017,
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
N. Lee,
J. Lau,
J. Lo,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
N. Lee,
Lin Jin,
J. Lo,
2018,
International Symposium on Microelectronics.
Dishit P. Parekh,
S. Skordas,
D. Mcherron,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
John H. Lau,
Ming Li,
Cao Xi,
2018,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Ming Li,
T. Uhrmann,
J. Burggraf,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).
J. Knickerbocker,
D. Mcherron,
R. Yu,
2023,
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC).