H. Song

Anomalous creep in Sn-rich solder joints

J. W. Morris, F. Hua, H. Song, 2002 .

Simultaneous Characterization of Theta-JC and Theta-JB Using Through-Package 1-D Heat Flow

S. Kang, Jae Choon Kim, H. Song, 2011 .

Microstructural evolution of eutectic Au-Sn solder joints

H. Song, 2002 .

Investigation of moisture-induced failures of stacked-die package

Hak Sung Kim, Ho Geon Song, H. Kim, 2007, Microelectron. Reliab..

A study on the chip-package-interaction for advanced devices with ultra low-k dielectric

Young Bae Kim, S. Kang, H. Song, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

A study on wafer level molding for realizing 3-D integration

H. Song, C S Lee, E K Choi, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Numerical investigation of heat transfer characteristics of moderator assembly employed in a low-enriched uranium nuclear thermal propulsion reactor

Xiang Chai, Xiaojing Liu, H. Song, 2022, Frontiers in Energy Research.