R. Lo

Identification of Mechanical Properties of Intermetallic Compounds on Lead Free Solder

Enboa Wu, Iting Tsai, Li-Jung Tai, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Characterization of thin films and intermetallic compounds in solder joint

Iting Tsai, Li-Jung Tai, S. Yen, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

How to select adhesive materials for temporary bonding and de-bonding of 200mm and 300mm thin-wafer handling for 3D IC integration?

J. H. Lau, M. Kao, J. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization

Kuo-Shu Kao, Tai-Hong Chen, John H. Lau, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Redistribution Layers (RDLs) for 2.5D/3D IC Integration

John H. Lau, P. Tzeng, M. Kao, 2013 .

Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP

Kuo-Shu Kao, Heng-Chieh Chien, J. H. Lau, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.