R. Kinyanjui

Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys

L. Lehman, E. Cotts, R. Kinyanjui, 2005 .

Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate

E. Cotts, R. Kinyanjui, A. Zribi, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Aspects of the structural evolution of lead-free solder joints

E. Cotts, R. Kinyanjui, L. Zavalij, 2002 .

Thermal cycling reliability, microstructural characterization, and assembly challenges with backward compatible soldering of a large, high density ball grid array

R. Coyle, R. Kinyanjui, V. Vasudevan, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories

L. Lehman, E. Cotts, R. Kinyanjui, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder

Peter Borgesen, R. Patel, R. Patel, 2004 .

Solder Joint Reliability of Pb-free SnAg-Cu Ball Grid Array ( BGA ) Components in Sn-Pb Assembly Process

R. Coyle, R. Kinyanjui, 2008 .

Microstructure and Damage Evolution in Sn-Ag-Cu Solder Joints

J. Wang, L. Lehman, E. Cotts, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

DESIGN AND PROCESS DEVELOPMENT FOR THE ASSEMBLY OF 01005 PASSIVE COMPONENTS

Krishnaswami Srihari, S. Poranki, J. Li, 2009 .