C. Luhmann

The Influence of Size and Composition on the Creep of SnAgCu Solder Joints

S. Rzepka, K. Wolter, M. Roellig, 2006, 2006 1st Electronic Systemintegration Technology Conference.

Arsenic doped buried plate characterization in deep trenches for a 0.25 μm complementary metal–oxide–semiconductor technology by chemical etching

R. Kurps, P. Gaworzewski, D. Krüger, 2000 .

Physical characterization of thin ALD–Al2O3 films

Uwe Schroeder, Johann W. Bartha, G. Dollinger, 2003 .

Surface functionalization of silicone rubber for permanent adhesion improvement.

S. Michel, K. Grundke, F. Simon, 2008, Langmuir : the ACS journal of surfaces and colloids.

Tailoring the Surface Properties of Silicone Elastomers to Improve Adhesion of Epoxy Topcoat

S. Michel, K. Grundke, F. Simon, 2011 .