K. Meier
发表
S. Rzepka,
K. Wolter,
M. Roellig,
2006,
2006 1st Electronic Systemintegration Technology Conference.
K. Wolter,
M. Roellig,
K. Meier,
2011,
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Manufacturing and Reliability Issues of Highly Integrated Packages for Power Electronic Applications
K. Bock,
M. Roellig,
K. Meier,
2019,
2019 42nd International Spring Seminar on Electronics Technology (ISSE).
M. Roellig,
K. Meier,
R. Metasch,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
S. Rzepka,
K. Wolter,
S. Wiese,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
K. Wolter,
M. Roellig,
K. Meier,
2014,
2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Karlheinz Bock,
Mike Roellig,
Karsten Meier,
2015,
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
S. Wiese,
F. Kraemer,
K. Meier,
2012,
2012 4th Electronic System-Integration Technology Conference.
M. Roellig,
K. Meier,
R. Metasch,
2010
.
K. Wolter,
K. Meier,
P. Saettler,
2011,
Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE).
H. Schlorb,
K. Meier,
M. Graf,
2011,
2011 IEEE International Interconnect Technology Conference.
K. Wolter,
K. Meier,
M. Froemmig,
2012
.
M. Roellig,
S. Wiese,
J. Al Ahmar,
2017,
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
K. Meier,
M. Roellig,
R. Schwerz,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
K. Wolter,
M. Roellig,
S. Wiese,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
K. Wolter,
M. Roellig,
S. Wiese,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
Karlheinz Bock,
Tobias Tiedje,
Karsten Meier,
2016,
2016 39th International Spring Seminar on Electronics Technology (ISSE).
K. Meier,
M. Roellig,
R. Metasch,
2013,
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
K. Meier,
M. Roellig,
F. Kraemer,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
A. Dasgupta,
K. Meier,
R. Höhne,
2022,
Microelectronics Reliability.
K. Wolter,
M. Roellig,
K. Meier,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
S. Wiese,
K.-J. Wolter,
K. Meier,
2008,
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.
S. Wiese,
K.-J. Wolter,
K. Meier,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
K. Bock,
K. Meier,
M. Luniak,
2020,
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
C. Endisch,
L. Reichel,
K. Meier,
2022,
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
K. Bock,
K. Meier,
M. Luniak,
2020,
2020 43rd International Spring Seminar on Electronics Technology (ISSE).
M. Roellig,
K. Meier,
R. Metasch,
2019,
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
S. Wiese,
F. Kraemer,
M. Roellig,
2018,
Microelectron. Reliab..
K. Bock,
Christian Götze,
K. Meier,
2021,
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
K. Meier,
M. Schaulin,
K. Bock,
2022,
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Christian Götze,
K. Meier,
M. Heine,
2022,
Electronics System-integration Technology Conference.
Christian Götze,
K. Meier,
M. Schaulin,
2022,
Microelectronics Reliability.
K. Bock,
K. Meier,
Thomas Ackstaller,
2020,
Information Security Solutions Europe.
K. Wolter,
M. Roellig,
K. Meier,
2011,
Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE).
J. Paul,
S. Schlipf,
A. Clausner,
2020,
2020 IEEE International Reliability Physics Symposium (IRPS).
K. Wolter,
M. Roellig,
S. Wiese,
2010
.
M. Roellig,
K. Meier,
Steffen Wiese,
2010,
3rd Electronics System Integration Technology Conference ESTC.
S. Wiese,
K.-J. Wolter,
K. Meier,
2010,
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
K. Wolter,
M. Roellig,
K. Meier,
2013,
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
K. Wolter,
F. Kraemer,
K. Meier,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
S. Wiese,
K.-J. Wolter,
K. Meier,
2010,
2010 12th Electronics Packaging Technology Conference.
K. Wolter,
M. Roellig,
S. Wiese,
2009,
2009 59th Electronic Components and Technology Conference.
K. Wolter,
M. Roellig,
S. Wiese,
2009,
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.