J. Dirk

Finite element modeling predicts the effects of voids on thermal shock reliability and thermal resistance of power device

J. Chang, L. Wang, J. Dirk, 2006 .

Finite Element Modeling Predicts the Effects of Voids on Thermal Shock Reliability and Thermal Resistance of Power Device The thermal-mechanical effects of void size and location in lead-free solder heatsink attachment of power devices is investigated

J. Chang, L. Wang, J. Dirk, 2013 .