X. Xie

Finite element modeling predicts the effects of voids on thermal shock reliability and thermal resistance of power device

J. Chang, L. Wang, J. Dirk, 2006 .

Effects of the Asphalt Permeable Pavement on Highway Runoff

L. Wang, X. Xie, Y. Xu, 2010 .

Finite element modelling of stress relaxation in glass lens moulding using measured, temperature-dependent elastic modulus and viscosity data of glass

A. Yi, R. Sooryakumar, X. Xie, 2006 .

Finite Element Modeling Predicts the Effects of Voids on Thermal Shock Reliability and Thermal Resistance of Power Device The thermal-mechanical effects of void size and location in lead-free solder heatsink attachment of power devices is investigated

J. Chang, L. Wang, J. Dirk, 2013 .

Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size

M. Thoben, J. Wilde, X. Xie, 2001, Microelectronics and reliability.