Yoshihiko Kanda

Effect of joint size on low-cycle fatigue properties of Sn-Ag-Cu solder joint

Y. Kariya, Kana Sato, S. Asari, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Influence of Asymmetrical Waveform on Low-Cycle Fatigue Life of Micro Solder Joint

Y. Kariya, Yoshihiko Kanda, 2010 .

Thermal fatigue life evaluation of CSP joints by mechanical fatigue testing

Shunichi Kikuchi, Yoshiharu Kariya, Yoshihiko Kanda, 2010, 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Effect of fiber orientation on the tensile properties of cross-ply laminates of PP reinforced continuous carbon fiber

Yoshihiko Kanda, K. Nagata, T. Isaki, 2021, Journal of Composite Materials.

Class I Creep Deformation of Sn–Ag–Cu Containing Solid Solution Elements and Its Effect on Thermal Fatigue Life of Solder Joints

Y. Kariya, Yoshihiko Kanda, Masaki Moriuchi, 2022, MATERIALS TRANSACTIONS.

Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint

Yoshiharu Kariya, Yoshihiko Kanda, Y. Kariya, 2012, Journal of Electronic Materials.

Effect of Strain-Enhanced Microstructural Coarsening on the Cyclic Strain-Hardening Exponent of Sn–Ag–Cu Joints

Y. Kariya, Yoshihiko Kanda, Takeshi Tasaka, 2012 .

Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

Yoshiharu Kariya, Yoshihiko Kanda, Y. Kariya, 2012, Microelectron. Reliab..

Influence of Temperature and Dwelling Time on Low-Cycle Fatigue Characteristic of Isotropic Conductive Adhesive Joint

Yoshiharu Kariya, Yoshihiko Kanda, Y. Kariya, 2010 .

Effect of Hold Time on Low Cycle Fatigue Life of Micro Solder Joint

Yoshiharu Kariya, Yoshihiko Kanda, Y. Kariya, 2008 .