P. Marjamaki

Finite element analysis of lead-free drop test boards

P. Marjamaki, T. Mattila, J. Kivilahti, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

A comparative study of the failure mechanisms encountered in drop and large amplitude vibration tests

P. Marjamaki, J.K. Kivilahti, T.T. Mattila, 2006, 56th Electronic Components and Technology Conference 2006.

Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions

P. Marjamaki, T. Mattila, J. Kivilahti, 2006, IEEE Transactions on Components and Packaging Technologies.

Modeling stresses in ultra-thin flip chips

P. Marjamaki, Jorma Kivilahti, T. Reinikainen, 2000, 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431).

Deformation characteristics and microstructural evolution of SnAgCu solder joints

P. Marjamaki, T. Reinikainen, J. Kivilahti, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..