Tiesong Lin

发表

D. P. Sekulic, Mengyuan Zhao, P. He, 2017, Journal of Electronic Materials.

P. He, Jun Wang, Tiesong Lin, 2013, 2013 14th International Conference on Electronic Packaging Technology.

K. Paik, P. He, Mingliang L. Huang, 2019, 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).

Tiesong Lin, Shuye Zhang, Yanxin Zhang, 2019, 2019 IEEE 19th International Conference on Nanotechnology (IEEE-NANO).

Jiake Li, Tiesong Lin, K. Lu, 2015 .

P. He, Jun Wang, Tiesong Lin, 2015, Journal of Electronic Materials.

Yunkai Shi, Zhanguo Liu, Panpan Lin, 2021, Journal of the European Ceramic Society.

P. He, Wei Guo, Tiesong Lin, 2019, Ceramics International.

D. P. Sekulic, P. He, Wanqin Zhao, 2021, Journal of Materials Research and Technology.

Wei Guo, P. He, Tiesong Lin, 2019, Ceramics International.

P. He, Wei Guo, Tiesong Lin, 2019, Materials Characterization.

P. He, Tiesong Lin, Shuye Zhang, 2019, Journal of Materials Science: Materials in Electronics.

D. P. Sekulic, P. He, Yan Liu, 2019, Journal of the European Ceramic Society.

D. Jia, Panpan Lin, Tiesong Lin, 2021, International Journal of Applied Ceramic Technology.

D. P. Sekulic, Zhihua Yang, P. He, 2017 .

Panpan Lin, Tiesong Lin, Shuye Zhang, 2022, Journal of Materials Research and Technology.

D. P. Sekulic, P. He, Jianhao Xu, 2020, Journal of Materials Science.

K. Paik, P. He, Tiesong Lin, 2019, Journal of Materials Science: Materials in Electronics.

Shuye Zhang, Peng He, Tiesong Lin, 2019, Journal of Materials Science: Materials in Electronics.

Yang Cao, K. Paik, P. He, 2019, Journal of Materials Science: Materials in Electronics.

Tiesong Lin, Peng He, Xiao-Rong Wang, 2016, The International Journal of Advanced Manufacturing Technology.

Tiesong Lin, Yang Bai, Bangsheng Li, 2022, Journal of Materials Science & Technology.

H. Inoue, P. He, Panpan Lin, 2021, Journal of the European Ceramic Society.

W. Guo, P. He, Panpan Lin, 2019, Procedia Manufacturing.

Hongjun Ji, Mingyu Li, Huanyu Cheng, 2020, ACS applied materials & interfaces.

K. Paik, P. He, Tiesong Lin, 2019, Lead Free Solders.

Ming Yang, K. Paik, P. He, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Tiesong Lin, Shuye Zhang, Xingxing Wang, 2022, International Journal of Modern Physics B.

W. Fei, J. Qi, Shulin Chen, 2019, Journal of colloid and interface science.

D. P. Sekulic, P. He, Tiesong Lin, 2016, Journal of Materials Engineering and Performance.

P. He, Tiesong Lin, Shuye Zhang, 2019, Journal of Materials Science: Materials in Electronics.

Yue Liu, Panpan Lin, Tiesong Lin, 2023, Composites Part B: Engineering.

Panpan Lin, Tiesong Lin, Shuye Zhang, 2023, Journal of Materials Research and Technology.

K. Paik, P. He, Tiesong Lin, 2018, 2018 20th International Conference on Electronic Materials and Packaging (EMAP).

Tiesong Lin, Shuye Zhang, P. He, 2019, 2019 IEEE 19th International Conference on Nanotechnology (IEEE-NANO).

Tiesong Lin, Shuye Zhang, Yinghao Feng, 2024, Journal of the European Ceramic Society.