Daniel T. Rooney

Materials characterization of the effect of mechanical bending on area array package interconnects

Doug Abbott, Dongji Xie, Daniel T. Rooney, 2003 .

Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules

Dongji Xie, Daniel T. Rooney, N. Todd Castello, 2007, Microelectron. Reliab..

Characterization of Fine Pitch CSP Solder Joints Under Board-Level Free Fall Drop (BFFD)

David Geiger, Dongkai Shangguan, Louis J. Gullo, 2005 .

Materials characterization of the effect of mechanical bending on area array package interconnects

Doug Abbott, Dongji Xie, Daniel T. Rooney, 2003, Microelectron. Reliab..

Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds

David Geiger, Daniel T. Rooney, Dongkai Shanguan, 2005, Microelectron. Reliab..