H. Ishino

6-in-1 Silicon carbide power module for high performance of power electronics systems

K. Sugiura, H. Ishino, Tomokazu Watanabe, 2014, 2014 IEEE 26th International Symposium on Power Semiconductor Devices & IC's (ISPSD).

Neuron size Si probe array fabricated on integrated circuits for multichannel electrode

M. Ishida, H. Takao, K. Sawada, 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

Low-pressure sintering bonding with Cu and CuO flake paste for power devices

K. Suganuma, S. W. Park, T. Sugahara, 2014, Electronic Components and Technology Conference.

Synthesis of Boryldiazenido Complexes from Tungsten Dinitrogen Complexes

H. Ishino, M. Hidai, Y. Ishii, 1998 .

Development of Solder Deterioration Diagnosis System of a Power Module via the Acoustic Emission Monitoring (AEM) Technique

K. Suganuma, Chuantong Chen, A. Suetake, 2021, International Symposium on Power Semiconductor Devices and IC's.

Synthesis, Structure, and Reactivities of the Five-Coordinate Molybdenum(0) Mono(acetylene) Complex [Mo(HC⋮CH)(dppe)2]1

H. Ishino, S. Kuwata, M. Hidai, 2001 .

Olefin Polymerization Catalyzed by Titanium−Tungsten Heterobimetallic Dinitrogen Complexes1

K. Hirata, H. Ishino, Tatsuya Miyatake, 2004 .

Syntheses, Structures, and Reactivities of Heterobimetallic Bridging Dinitrogen Complexes Containing Group 6 and Group 4 or 5 Transition Metals1

H. Ishino, S. Kuwata, M. Hidai, 2001 .

A novel technique for preparing dental CAD/CAM composite resin blocks using the filler press and monomer infiltration method.

T. Hayakawa, H. Ishino, K. Okada, 2014, Dental materials journal.

Quasi-transient liquid-phase bonding by eutectic reaction of Sn-plated Zn on Cu substrate for high-temperature die attachment

K. Suganuma, S. W. Park, S. Nagao, 2015 .

Online Condition Monitoring of Solder Fatigue in a Clip-Bonding SiC mosfet Power Assembly via Acoustic Emission Technique

K. Suganuma, Chuantong Chen, A. Suetake, 2023, IEEE Transactions on Power Electronics.

High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics

K. Suganuma, S. Nagao, K. Sugiura, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.