F. Qin
发表
F. Xie,
Congbin Yang,
Tao Zhang,
2022,
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science.
Zhao Shuai,
Yan-Hua Gong,
F. Qin,
2021
.
F. Qin,
Tong An,
Pei Chen,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Daquan Yu,
Chaodong Yang,
F. Qin,
2019,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Yong Liu,
F. Qin,
Xuejun Fan,
2018,
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
Haofeng Chen,
Yinghua Liu,
F. Qin,
2020,
International Journal of Mechanical Sciences.
F. Qin,
Yanwei Dai,
Tong An,
2020
.
F. Qin,
Tong An,
Si Chen,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
F. Qin,
Tong An,
Si Chen,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Yinghua Liu,
F. Qin,
Yanwei Dai,
2019,
Engineering Fracture Mechanics.
F. Berto,
Y. Chao,
Yinghua Liu,
2019,
International Journal of Solids and Structures.
Liang Tang,
F. Qin,
Pei Chen,
2015,
2015 16th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2019,
Current Applied Physics.
F. Qin,
Tong An,
Pei Chen,
2018
.
F. Qin,
Tong An,
Pei Chen,
2016
.
F. Qin,
Tong An,
Pei Chen,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
F. Berto,
Haofeng Chen,
Yinghua Liu,
2021,
International Journal of Fracture.
F. Qin,
Chao Ren,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
F. Berto,
Haofeng Chen,
Yinghua Liu,
2021,
Theoretical and Applied Fracture Mechanics.
G. Qian,
Yinghua Liu,
F. Qin,
2019,
Theoretical and Applied Fracture Mechanics.
F. Qin,
Tong An,
Pei Chen,
2018,
Journal of Materials Science: Materials in Electronics.
F. Qin,
Pei Chen,
Huiping Yu,
2020
.
Zhiwei Zhang,
F. Qin,
Pei Chen,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Zhiwei Zhang,
F. Qin,
Pei Chen,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Tong An,
Pei Chen,
2016
.
F. Qin,
Pei Chen,
Yadong Li,
2021,
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2019,
Microelectronics Reliability.
Minghui Liu,
F. Qin,
Yanwei Dai,
2022,
Surfaces and Interfaces.
Chenshuo Liu,
F. Qin,
Pei Chen,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Yanning Li,
F. Qin,
Yanwei Dai,
2021,
Engineering Fracture Mechanics.
F. Qin,
Pei Chen,
Jinglong Sun,
2016,
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Shuai Zhao,
2022,
Theoretical and Applied Fracture Mechanics.
F. Qin,
Tong An,
Pei Chen,
2017,
Journal of Electronic Materials.
F. Qin,
Tong An,
2013
.
F. Qin,
Yanwei Dai,
Hao Yu,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Yanning Li,
F. Qin,
Yanwei Dai,
2022,
Engineering Fracture Mechanics.
C. Qian,
Jiajie Fan,
Xuejun Fan,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Fei Qin,
Tong An,
F. Qin,
2011
.
F. Qin,
Tong An,
T. An,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
F. Qin,
Yanwei Dai,
Tong An,
2023,
Materials Science in Semiconductor Processing.
F. Berto,
Yinghua Liu,
F. Qin,
2021,
International Journal of Fracture.
Yinghua Liu,
F. Qin,
Yanwei Dai,
2021
.
Fei Qin,
Huiping Yu,
Yanpeng Gong,
2021,
Engineering Analysis with Boundary Elements.
Y. Gong,
F. Qin,
Huiping Yu,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
C. Dong,
J. Trevelyan,
Y. Gong,
2020,
Computer Methods in Applied Mechanics and Engineering.
X.Q. Shi,
F. Qin,
X.Q. Shi,
2006,
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Fei Qin,
Tao Wang,
Tong An,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Chunhai Wang,
F. Qin,
Tong An,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
Fei Qin,
Tong An,
Na Chen,
2010
.
Fei Qin,
Tong An,
F. Qin,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
Fei Qin,
Tong An,
Na Chen,
2009
.
Yanning Li,
F. Qin,
Yanwei Dai,
2023,
Fatigue & Fracture of Engineering Materials & Structures.
Y. Gong,
F. Qin,
Yanwei Dai,
2020,
Journal of Electronic Materials.
F. Qin,
Tong An,
Xia Guofeng,
2014
.
Tong An,
Fei Qin,
Cha Gao,
2013
.
Fei Qin,
Jiangang Li,
Tong An,
2011,
Microelectron. Reliab..
Tong An,
Na Chen,
Fei Qin,
2008,
International Conference on Experimental Mechanics.
F. Qin,
Pei Chen,
Shaowei Li,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Tong An,
2016
.
Yinghua Liu,
F. Qin,
Yanwei Dai,
2019
.
F. Qin,
Lingyun Liu,
Yanwei Dai,
2021,
Journal of Electronic Packaging.
Yanning Li,
Y. Gong,
F. Qin,
2021,
Materials Science and Engineering: A.
Huaicheng Li,
Tong An,
Fei Qin,
2016
.
Tao Tang,
Pei Chen,
Chao Fang,
2018,
Microelectron. Reliab..
G. Qian,
Yinghua Liu,
W. Feng,
2020
.
Pei Chen,
Fei Qin,
Min Zhang,
2019,
Engineering Fracture Mechanics.
F. Qin,
Yanwei Dai,
Tong An,
2021
.
Min Zhang,
F. Qin,
Yanwei Dai,
2023,
IEEE Transactions on Device and Materials Reliability.
F. Qin,
Yanwei Dai,
Tong An,
2022,
Journal of Electronic Materials.
Si Chen,
Fei Qin,
Yunfei En,
2018,
Microelectron. Reliab..
Pei Chen,
Bin Xie,
Fei Qin,
2016,
Microelectron. Reliab..
F. Qin,
Yanwei Dai,
Yifan Jin,
2022,
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Y. Gong,
F. Qin,
Qi He,
2021,
Boundary Elements and other Mesh Reduction Methods XLIV.
F. Qin,
Yanwei Dai,
Tong An,
2020
.
Pei Chen,
Fei Qin,
Tong An,
2019,
IEEE Transactions on Power Electronics.
D. Yan,
F. Qin,
2008
.
Fei Qin,
Tong An,
F. Qin,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
Bin Wu,
Fei Qin,
Qiang Han,
2017,
Ultrasonics.
Zhiwei Zhang,
F. Qin,
Tong An,
2018
.
Cha Gao,
F. Qin,
Zhu Wenhui,
2012
.
L. Susmel,
F. Qin,
Yanwei Dai,
2020
.
F. Qin,
Yanwei Dai,
Ping Chen,
2023,
Crystals.
Chenshuo Liu,
Zhiwei Zhang,
F. Qin,
2019,
Modelling and Simulation in Materials Science and Engineering.
Fei Qin,
Quan Xu,
Junfei Ma,
2019,
Langmuir : the ACS journal of surfaces and colloids.
Fei Qin,
Pei Chen,
Zhiwei Zhang,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2021,
IEEE Journal of Emerging and Selected Topics in Power Electronics.
F. Qin,
Yanwei Dai,
Pei Chen,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Lingyun Liu,
Yanwei Dai,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Tong An,
2023,
International Journal of Adhesion and Adhesives.
F. Qin,
Yanwei Dai,
Tong An,
2023,
Materials.
Fei Qin,
Tong An,
F. Qin,
2014,
Microelectron. Reliab..
Ying Li,
Fei Qin,
Liming Chen,
2006
.
Yun Huang,
F. Qin,
Tong An,
2020,
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
Daquan Yu,
F. Qin,
Shuai Zhao,
2021,
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
Fei Qin,
Shuai Zhao,
Yanwei Dai,
2020,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
F. Qin,
Yanwei Dai,
Tong An,
2020,
IEEE Transactions on Device and Materials Reliability.
Daquan Yu,
F. Qin,
Zuohuan Chen,
2022,
Micromachines.
Fei Qin,
Tong An,
F. Qin,
2017,
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
F. Qin,
Yanwei Dai,
Jiahui Wei,
2023,
Engineering Fracture Mechanics.
Zhiwei Zhang,
F. Qin,
Tong An,
2018,
Japanese Journal of Applied Physics.
Shaolin Xu,
F. Qin,
Pei Chen,
2023,
Journal of Materials Processing Technology.
Chenshuo Liu,
F. Qin,
Pei Chen,
2019,
2019 20th International Conference on Electronic Packaging Technology(ICEPT).
Lixi Wan,
Wen Yin,
Daquan Yu,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Xiaoxiao Dong,
Quan Xu,
F. Qin,
2020
.
F. Qin,
Yanwei Dai,
Si Chen,
2023,
Materials.
Daquan Yu,
F. Qin,
Huiping Yu,
2018,
2018 19th International Conference on Electronic Packaging Technology (ICEPT).