Y. Wang

On the Two-Parameter Characterization of Elastic-Plastic Crack-Front Fields in Surface-Cracked Plates

Y. Wang, 1993 .

Finite element modeling of CSP package subjected to board level drop test

T. Chai, Y. Wang, T.C. Chai, 2004, Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).

Modeling of long-term creep behavior of structural epoxy adhesives

Hung-Jue Sue, H. Sue, Y. Wang, 2005 .

Characterisation of constraint effect on cleavage fracture using T-stress

D. Parks, Y. Wang, 1992 .

Development of circumferential through-wall crack K-solutions for control rod drive mechanism nozzles

Gery Wilkowski, Yong-Yi Wang, Wallace Norris, 2004 .