J. Dupuy

发表

Photo-rheometry/NIR spectrometry: An in situ technique for monitoring conversion and viscoelastic properties during photopolymerization

A. Roche, V. Verney, A. Botella, 2004 .

In situ RHEED monitoring of carbon incorporation during SiGeC/Si(001) growth in a UHV-CVD system

D. Bouchier, Y. Zheng, J. Dupuy, 2002 .

A simple model to explain the complex kinetic behavior of epoxy/anhydride systems

J. Dupuy, Roberto J. J. Williams, C. Riccardi, 1999 .

Cure kinetics of diglycidylether of bisphenol A– ethylenediamine revisited using a mechanistic model

J. Dupuy, Roberto J. J. Williams, C. Riccardi, 2001 .

Tuning morphologies of thermoset / thermoplastic blends Part 2: Phase separation of poly(vinyl methyl ether), PVME, using amine mixtures as thermoset hardeners

J. Dupuy, M. Dumon, Nadir Lahlali, 2006 .

Tuning morphologies of thermoset / thermoplastic blends Part 1: Kinetic modelling of epoxy-amine reactions using amine mixtures

J. Dupuy, M. Dumon, Nadir Lahlali, 2006 .

Toward a better reliability in the deconvolution of SIMS depth profiles

B. Gautier, J. Dupuy, G. Prudon, 1998 .

Validation in process-like conditions of the kinetic and thermophysical modeling of a dicyanate ester/glass fibers composite

M. Raynaud, J. Pascault, E. Leroy, 2002 .

Correlation between electromigration and Cu-contact angle after de-wetting

T. Mourier, J. Dupuy, M. Cordeau, 2006 .

Morphology of a linear polymer-modified epoxy-amine formulation cured by microwave energy at different heating rates

J. Galy, C. More, M. Delmotte, 2001 .

A Method of Estimating Kinetic Parameters of Thermoset Cures: Application to a Dicyanate Ester Resin

E. Leroy, A. Maazouz, J. Dupuy, 2001 .

Electron mobility enhancement in a strained Si channel

I. Sagnes, J. Dupuy, P. A. Badoz, 1995 .

Curing kinetics of liquid-crystalline epoxy resins with inverse reactivity ratios

B. Simionescu, C. Novat, P. Navard, 2000 .

Supported Metallocene Catalysts in Olefin Polymerization: Toward High Performances

V. Pasquet, J. Dupuy, T. Saudemont, 1999 .

Deconvolution of SIMS depth profiles: Towards simple and faster techniques

J. Dupuy, F. Boulsina, M. Berrabah, 2008 .

Modification of Ziegler‐Natta catalysts by cyclopentiadienyl‐type ligands: Activation of titanium‐based catalysts

J. Dupuy, R. Spitz, 1997 .

Evolution of the coefficient of thermal expansion of a thermosetting polymer during cure reaction

G. Seytre, E. Leroy, A. Maazouz, 2005 .

Straightforward preparation of polymers based on oligodimethylsiloxane and alkylamine

J. Dupuy, E. Fleury, N. Sintès-Zydowicz, 2012 .

Study of UV Cure Kinetics Resulting from a Changing Concentration of Mobile and Trapped Radicals

G. Seytre, D. Kranbuehl, J. Dupuy, 2008 .

The multicomponent Debus–Radziszewski reaction in macromolecular chemistry

S. Saxer, R. Mercier, J. Dupuy, 2018 .

The formation of tungsten disilicide from WSi and WCrSi structures

C. Dubois, J. Dupuy, P. Pinard, 1992 .

Synergetic catalytic effect of carbon nanotubes and polyethersulfone on polymerization of glassy epoxy-based systems – isothermal kinetic modelling

J. Gérard, J. Duchet-Rumeau, J. Dupuy, 2014 .

The influence of growth techniques on the structure of epitaxial ErSi1.7 on Si(111)

T. Tan, J. Veuillen, K. Lefki, 1993 .

Cure kinetics of an epoxy/liquid aromatic diamine modified with poly(ether imide)

J. Gérard, J. Dupuy, M. Naffakh, 2005 .

Determination of activation energy and preexponential factor of thermoset reaction kinetics using differential scanning calorimetry in scanning mode: Influence of baseline shape on different calculation methods

E. Leroy, A. Maazouz, J. Dupuy, 2000 .

Synthesis and properties of polyamides from 2,5‐furandicarboxylic acid

J. Galy, A. Rousseau, J. Dupuy, 2018 .

Polyurethane and unsaturated polyester hybrid networks: Chemorheological and dielectric study for the resin transfer molding process (RTM)

G. Seytre, A. Maazouz, J. Dupuy, 2000 .

Ice nucleation in aqueous electrolytes by light scattering observation

J. Fornazero, J. Dupuy, A. E. Hachadi, 1991 .

Cu surface treatment influence on Si adsorption properties of CuSiN self-aligned barriers for sub-65nm technology node

S. Chhun, J. Michelon, L. Pinzelli, 2006 .

Molecular modelling of polyphthalamides thermal properties: Comparison between modelling and experimental results

J. Galy, J. Dupuy, Thibault Cousin, 2012 .

Surface roughening and erosion rate change at low energy SIMS depth profiling of silicon during oblique O2+ bombardment

B. Fares, B. Gautier, J. Dupuy, 2006 .

Treatment of LESIMS Depth Profiles: a Procedure for Eliminating the Roughness Effect

J. Dupuy, F. Hamdi, F. Boulsina, 2006, 2006 2nd International Conference on Information & Communication Technologies.

Deconvolution of very low primary energy SIMS depth profiles

B. Fares, B. Gautier, J. Dupuy, 2006 .

Proposal of a New Variant Resolution Function Adapted to the Low Energies in SIMS

J. Dupuy, B. Fayçal, B. Meriem, 2006, 2006 2nd International Conference on Information & Communication Technologies.

Backside and frontside depth profiling of B delta doping, at low energy, using new and previous magnetic SIMS instruments

R. Truche, H. Moriceau, F. Laugier, 2004 .

SIMS depth profile correction for the study of the first step of the diffusion of boron in silicon

B. Gautier, J. Dupuy, B. Semmache, 1998 .

Modeling of transfer phenomena on heterogeneous Ziegler catalysts: Differences between theory and experiment in olefin polymerization (an introduction)

T. McKenna, J. Dupuy, R. Spitz, 1995 .

Study of atomic transport mechanism of oxygen during thermal nitridation of silicon dioxide

J. Dupuy, R. L. Bihan, J. Chartier, 1991 .

Kinetic modeling of an unsaturated polyester resin using two complementary techniques : Near infrared spectroscopy and heat flux sensors

Vincent Sobotka, Didier Delaunay, D. Delaunay, 2005 .

High‐temperature thermal nitridation and low‐temperature electron‐beam‐enhanced nitridation of SiO2 thin films

A. Ronda, J. Dupuy, B. Balland, 1987 .

Silicon nitride films deposited by Hg-photosensitization chemical vapor deposition

M. Lemiti, J. Dupuy, B. Balland, 1992 .

Kinetics modeling of the reaction for an Epoxy/PMMA/MMT ternary system

J. Dupuy, H. Sautereau, J. Duchet, 2007 .

Impact of introducing CuSiN self-aligned barriers in advanced copper interconnects

P. Chausse, D. Delille, B. Gautier, 2005 .