S. Neo

Defect localization enhancement using light induced CI-AFP

C. Q. Chen, N. Dayanand, A. Quah, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure Analysis Methodology on Unique 68 mm Single Ring Pattern Due to Load Lock

A. Quah, S. Neo, M. Gunawardana, 2011 .

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. Reliab..

FIB sample preparation for TEM failure analysis of advanced devices

C. Q. Chen, Y. N. Hua, C. Chen, 2010, 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Defect Prediction Approach to enhance Static Fault Localization of Functional Logic Failure Defects using NIR Photon Emission Microscopy

S. L. Ting, A. Quah, S. Neo, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).