G. Ang

Defect localization enhancement using light induced CI-AFP

C. Q. Chen, N. Dayanand, A. Quah, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Electrical simulation on the localized NVM failed cell by AFP nanoproing

C. Q. Chen, G. B. Ang, Z. H. Mai, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

In-depth circuits edit analysis to reveal the implantation-related defect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. J..

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. Reliab..

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis

C. Q. Chen, Francis Rivai, G. B. Ang, 2017, Microelectron. Reliab..

Fault isolation on the wafer with lithography hotspot signature

C. Q. Chen, J. Lam, Francis Rivai, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Defect Prediction Approach to enhance Static Fault Localization of Functional Logic Failure Defects using NIR Photon Emission Microscopy

S. L. Ting, A. Quah, S. Neo, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).