Z. Mai

发表

Defect localization enhancement using light induced CI-AFP

C. Q. Chen, N. Dayanand, A. Quah, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Short failure analysis under fault isolation

C. E. Soh, Z. Mai, M. Palaniappan, 2001, Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548).

Use of Nanoprobing as the Diagnostic Tool for Nanoscaled Devices

Q.F. Wang, P. K. Tan, H. Tan, 2007, 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Using Probing Techniques to Identify and Study High Leakage Issues in the Development of 90nm Process and Below

P. K. Tan, W. Chim, Z. Mai, 2006, 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Theoretical and practical approach to overcome curvature radius limitation of conductive atomic force microscopy tip for imaging of advanced technological node static random access memory devices

P. K. Tan, M. K. Dawood, P. S. Limin, 2014 .

Fourier Transform Infrared Spectroscopy of Low-k Dielectric Material on Patterned Wafers

Handong Sun, Zexiang Shen, Z. Mai, 2012 .

Problems of and Solutions for Coating Techniques for TEM Sample Preparation on Ultra Low-k Dielectric Devices after Progressive-FIB Cross-section Analysis

P. K. Tan, Z. Mai, J. Lam, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Strain measurement of Fin structure using TEM objective lens dark-field off-axis holography

Z. Mai, A. Du, S. P. Zhao, 2013, Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Fourier Transform Infrared Spectroscopy of Low-k Dielectric Material on Patterned Wafers

Handong Sun, Zexiang Shen, Z. Mai, 2012 .

Experiments and results of Raman and FTIR complementary vibrational spectroscopy for IC reliability failure analysis

Z. Mai, J. Lam, H. Tan, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study

Z. H. Mai, D. D. Wang, J. Lam, 2014, 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW).

A developed wedge fixtures assisted high precision TEM samples pre-thinning method: Towards the batch lamella preparation

D. D. Wang, Binghai Liu, Z. Mai, 2017 .

Two planar polishing methods by using FIB technique: Toward ultimate top-down delayering for failure analysis

H. H. Yap, D. D. Wang, P. K. Tan, 2015 .

UV-Raman Microscopy on the Analysis of Ultra-Low-K Dielectric Materials on Patterned Wafers

M. K. Dawood, Z. Mai, J. Lam, 2013 .

Structure and composition of the Cu/low k interconnects de-layered with FIB

P. K. Tan, Z. Mai, J. Lam, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

High temperature nanoprobing application for SRAM soft failure fault isolation

Z. H. Mai, P. T. Ng, C. Q. Chen, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Cross-sectional nanoprobing fault isolation technique on submicron devices

L. Zhu, Ran He, Y. Z. Zhao, 2016, Microelectron. Reliab..

Electrical simulation on the localized NVM failed cell by AFP nanoproing

C. Q. Chen, G. B. Ang, Z. H. Mai, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

On-chip device and circuit diagnostics on advanced technology nodes by nanoprobing

J. Lam, T. H. Ng, Z. H. Mai, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

In-depth circuits edit analysis to reveal the implantation-related defect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. J..

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. Reliab..

Embed SRAM IDDOFF fail root cause identification by combination of device analysis and localized circuit analysis

C. Q. Chen, Francis Rivai, G. B. Ang, 2017, Microelectron. Reliab..

Fault isolation on the wafer with lithography hotspot signature

C. Q. Chen, J. Lam, Francis Rivai, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Study of Si nanocrystal growth and characterization for Si nanocrystal embeded nonvolatile memory

P. K. Tan, Z. Mai, J. Lam, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Si nano-particle characterization by atomic force microscopy and electronic beam techniques

P. K. Tan, Binghai Liu, Z. Mai, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Cross-sectional nanoprobing sample preparation on sub-micron device with fast laser grooving technique

Ran He, Hao Tan, Pik Kee Tan, 2018, Microelectronics and reliability.

Application of Fast Laser Deprocessing Techniques on large cross-sectional view area sample with FIB-SEM dual beam system

L. Zhu, Ran He, Hao Tan, 2016, Microelectron. Reliab..

Electron radiation-induced material diffusion and nanocrystallization in nanostructured amorphous CoFeB thin film

P. K. Tan, D. Houssameddine, T. Tahmasebi, 2018, Acta Materialia.

Key Issues for Implementing Smart Polishing in Semiconductor Failure Analysis

Yamin Huang, Zhihong Mai, Lei Zhu, 2017 .

Characterization of anti-stiction coatings for MEMS applications

Z. Mo, Z. Mai, J. Lam, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Crystal thickness and extinction distance measurements by convergent beam electron diffraction fitting and application in quantitative TEM holography analysis on p-n junctions

C. Q. Chen, P. K. Tan, Binghai Liu, 2015 .

The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM

Pik Kee Tan, Jeffrey Lam, Binghai Liu, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Electrical characteristics of leakage issues caused by defective Ni salicide

P. K. Tan, Z. Mai, J. Lam, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Application of conductive atomic force microscopy to study the in-line electrical defects

P. K. Tan, Z. Mai, J. Lam, 2008, 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

In-Depth Electrical Analysis to Reveal the Failure Mechanisms With Nanoprobing

Q.F. Wang, P. K. Tan, H. Tan, 2008, IEEE Transactions on Device and Materials Reliability.

A sample preparation methodology to reduce sample edge unevenness and improve efficiency in delayering the 20-nm node IC chips

H. H. Yap, D. D. Wang, P. K. Tan, 2015, 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Failure analysis on 14 nm FinFET devices with ESD CDM failure

Pik Kee Tan, Yuzhe Zhao, Zhihong Mai, 2018, Microelectron. Reliab..

Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique

Ran He, Y. Z. Zhao, B. Liu, 2015, Microelectron. Reliab..

Defect Prediction Approach to enhance Static Fault Localization of Functional Logic Failure Defects using NIR Photon Emission Microscopy

S. L. Ting, A. Quah, S. Neo, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).