J. Lam

发表

Defect localization enhancement using light induced CI-AFP

C. Q. Chen, N. Dayanand, A. Quah, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Electrical reliability of ultra-low K dielectric of an IC device of its optical spectroscopic characterization

J. Lam, 2013 .

Use of Nanoprobing as the Diagnostic Tool for Nanoscaled Devices

Q.F. Wang, P. K. Tan, H. Tan, 2007, 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Using Probing Techniques to Identify and Study High Leakage Issues in the Development of 90nm Process and Below

P. K. Tan, W. Chim, Z. Mai, 2006, 2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Theoretical and practical approach to overcome curvature radius limitation of conductive atomic force microscopy tip for imaging of advanced technological node static random access memory devices

P. K. Tan, M. K. Dawood, P. S. Limin, 2014 .

Fourier Transform Infrared Spectroscopy of Low-k Dielectric Material on Patterned Wafers

Handong Sun, Zexiang Shen, Z. Mai, 2012 .

Problems of and Solutions for Coating Techniques for TEM Sample Preparation on Ultra Low-k Dielectric Devices after Progressive-FIB Cross-section Analysis

P. K. Tan, Z. Mai, J. Lam, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

In situ TEM study of electron-beam radiation induced boron diffusion and effects on phase and microstructure evolution in nanostructured CoFeB/SiO2 thin film

P. K. Tan, Bin Liu, Z. Mai, 2017 .

Advanced TEM applications in semiconductor devices

Z. Mo, J. Lam, A. Du, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Vibrational spectroscopy of low-k/ultra-low-k dielectric materials on patterned wafers

Handong Sun, Choun Pei Wong, Zexiang Shen, 2011 .

Fourier Transform Infrared Spectroscopy of Low-k Dielectric Material on Patterned Wafers

Handong Sun, Zexiang Shen, Z. Mai, 2012 .

Experiments and results of Raman and FTIR complementary vibrational spectroscopy for IC reliability failure analysis

Z. Mai, J. Lam, H. Tan, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure mechanism analysis and process improvement on time-dependent dielectric breakdown of Cu/ultra-low-k dielectric based on complementary Raman and FTIR spectroscopy study

Z. H. Mai, D. D. Wang, J. Lam, 2014, 2014 IEEE International Integrated Reliability Workshop Final Report (IIRW).

A developed wedge fixtures assisted high precision TEM samples pre-thinning method: Towards the batch lamella preparation

D. D. Wang, Binghai Liu, Z. Mai, 2017 .

UV-Raman Microscopy on the Analysis of Ultra-Low-K Dielectric Materials on Patterned Wafers

M. K. Dawood, Z. Mai, J. Lam, 2013 .

Structure and composition of the Cu/low k interconnects de-layered with FIB

P. K. Tan, Z. Mai, J. Lam, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Structural and composition investigations at delayered locations of low k integrated circuit device by gas-assisted focused ion beam

D. D. Wang, P. K. Tan, J. Lam, 2014 .

In-depth circuits edit analysis to reveal the implantation-related defect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. J..

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. Reliab..

Fault isolation on the wafer with lithography hotspot signature

C. Q. Chen, J. Lam, Francis Rivai, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Study of Si nanocrystal growth and characterization for Si nanocrystal embeded nonvolatile memory

P. K. Tan, Z. Mai, J. Lam, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Si nano-particle characterization by atomic force microscopy and electronic beam techniques

P. K. Tan, Binghai Liu, Z. Mai, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Optimization of an Artificial Neural Network System for the Prediction of Failure Analysis Success

Hao Hu, Lin Zhao, S. H. Goh, 2019, Microelectronics Reliability.

Prediction of Electrical and Physical Failure Analysis Success Using Artificial Neural Networks

Hao Hu, Lin Zhao, Jeffrey Lam, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Electron radiation-induced material diffusion and nanocrystallization in nanostructured amorphous CoFeB thin film

P. K. Tan, D. Houssameddine, T. Tahmasebi, 2018, Acta Materialia.

Key Issues for Implementing Smart Polishing in Semiconductor Failure Analysis

Yamin Huang, Zhihong Mai, Lei Zhu, 2017 .

Characterization of anti-stiction coatings for MEMS applications

Z. Mo, Z. Mai, J. Lam, 2017, 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Crystal thickness and extinction distance measurements by convergent beam electron diffraction fitting and application in quantitative TEM holography analysis on p-n junctions

C. Q. Chen, P. K. Tan, Binghai Liu, 2015 .

The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM

Pik Kee Tan, Jeffrey Lam, Binghai Liu, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Electrical characteristics of leakage issues caused by defective Ni salicide

P. K. Tan, Z. Mai, J. Lam, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Application of conductive atomic force microscopy to study the in-line electrical defects

P. K. Tan, Z. Mai, J. Lam, 2008, 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

In-Depth Electrical Analysis to Reveal the Failure Mechanisms With Nanoprobing

Q.F. Wang, P. K. Tan, H. Tan, 2008, IEEE Transactions on Device and Materials Reliability.

Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure

Fan Zhang, Jeffrey Lam, Zexiang Shen, 2013 .

Enhancement of Raman signals from low-k dielectrics with angle-resolved light scattering on nanostructure patterned Cu/low-k interconnects of IC devices

P. K. Tan, J. Lam, Maggie Yamin Huang, 2015 .

Formation of abnormal dual‐peak profiles in large tilt angle boron implantation

J. Lam, Lei Zhu, Z. Mai, 2017 .

Solving 28 nm I/O circuit reliability issue due to IC design weakness

Yi Chao Low, Pik Kee Tan, Soon Leng Tan, 2018, Microelectron. Reliab..

Top-down delayering to expose large inspection area on die side-edge with Platinum (Pt) deposition technique

Ran He, Y. Z. Zhao, B. Liu, 2015, Microelectron. Reliab..

Defect Prediction Approach to enhance Static Fault Localization of Functional Logic Failure Defects using NIR Photon Emission Microscopy

S. L. Ting, A. Quah, S. Neo, 2018, 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Cross-sectional nanoprobing fault isolation technique on submicron devices

L. Zhu, Ran He, Y. Z. Zhao, 2016, Microelectron. Reliab..