Y. Y. Ong

Application of piezoresistive stress sensors in ultra thin device handling and characterization

Qing Xin Zhang, D. Kwong, V. Sundaram, 2009 .

A Study To Reduce Chemical Waste Generated in Chemistry Teaching Laboratories

Y. Y. Ong, Hui Yi. Goh, W. Wong, 2020, Journal of Chemical Education.

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

John H. Lau, V. Kripesh, Shiguo Liu, 2009, 2009 59th Electronic Components and Technology Conference.

Understanding the Specific Technical Requirements Needed for Successful Transitioning to a Workplace and the Chemistry Undergraduate Course Syllabi: A Case Study

Y. Y. Ong, Hui Yi. Goh, Clarence Wong, 2020, Journal of Chemical Education.

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package

John H. Lau, Xiaowu Zhang, Vempati Srinivasa Rao, 2010, Microelectron. Reliab..

Development of Large Die Fine-Pitch Cu/Low- $k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Shiguo Liu, Yue Ying Ong, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

Zhong Chen, Kai Chong Chan, Yeow Kheng Lim, 2009, Microelectron. Reliab..

Electromigration study of 50 µm pitch micro solder bumps using four-point Kelvin structure

J. Lau, V. S. Rao, T. Chai, 2009, 2009 59th Electronic Components and Technology Conference.