Jun Chen

发表

Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling

Xueguan Song, P. Råback, N. Zhao, 2018 .

Effect of Ag 3 Sn nanoparticles and temperature on Cu 6 Sn 5 IMC growth in Sn-xAg/Cu solder joints

N. Zhao, Yunpeng Wang, Haitao Ma, 2018 .

Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows

Haoran Ma, N. Zhao, Mingliang L. Huang, 2018, Journal of Materials Science: Materials in Electronics.

Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage

N. Zhao, Yunpeng Wang, Haitao Ma, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows

Haoran Ma, N. Zhao, Yunpeng Wang, 2017 .

Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows

Haoran Ma, N. Zhao, Mingliang L. Huang, 2017, Journal of Materials Science: Materials in Electronics.

Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy

Jun Chen, Yunpeng Wang, Xueguan Song, 2018, Microelectron. Reliab..

Reliability testing of WLCSP lead-free solder joints

Jun Chen, Huann-Wu Chiang, Jun-Yuan Chen, 2006 .

Interfacial reaction study on a solder joint with Sn-4Ag-0.5Cu solder ball and Sn-7Zn-Al (30 ppm) solder paste in a lead-free wafer level chip scale package

Jun Chen, S. Li, J. Lee, 2004 .

Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

Jun Chen, Yunpeng Wang, Xueguan Song, 2018, Microelectron. Reliab..

Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and IMCs during multiple reflows

Haoran Ma, N. Zhao, Yunpeng Wang, 2017 .

The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder

Jun Chen, Huann-Wu Chiang, K. Chang, 2006 .

Significant effect of orientation on Cu6Sn5 coarsening behavior in isothermal aging process

Xiaogan Li, Liying Sun, Haoran Ma, 2020, Journal of Materials Science: Materials in Electronics.

Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage

N. Zhao, Mingliang L. Huang, Yunpeng Wang, 2017, Journal of Materials Science: Materials in Electronics.

New phenomenon: Cellular boundary during the isothermal stage in the Sn-3Ag/(0 0 1)Cu and Sn-3.5Ag/(0 0 1)Cu joint

Haoran Ma, Yunpeng Wang, Haitao Ma, 2022, Materials Letters.