Xing-Fei Zhao

Size effect on the interfacial reaction and IMC growth of Sn–3.0Ag–0.5Cu/Cu joints with the decreasing joint size to several tens of microns during reflowing soldering

Xing-Fei Zhao, Min-bo Zhou, Tao Sun, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Solder size effect on interfacial reaction and growth behavior of Cu–Sn intermetallic compounds in cross-scale Sn3.0Ag0.5Cu/Cu joints between stacking TSV chips during step-reflow processes

Tao Xu, Xing-Fei Zhao, Min-bo Zhou, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Microstructures and shear properties of mixed assembly BGA structure SnAgCu/SnBi(Ag)/Cu joints in board-level packaging

Xing-Fei Zhao, Xin-Ping Zhang, Jia-Qiang Huang, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).