Tao Sun

Size effect on the interfacial reaction and IMC growth of Sn–3.0Ag–0.5Cu/Cu joints with the decreasing joint size to several tens of microns during reflowing soldering

Xing-Fei Zhao, Min-bo Zhou, Tao Sun, 2018, 2018 19th International Conference on Electronic Packaging Technology (ICEPT).

Effect of loading rate on the shear performance and fracture behavior of micro-scale BGA structure Cu/Sn–3.0Ag–0.5Cu/Cu joints under coupled electromechanical loads

W. Le, Tao Sun, Xin-Ping Zhang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Influences of Ag and Zn contents on interfacial microstructure and corrosion behavior of Sn–Zn–Ag/6061Al joints in antenna module packages

Tao Sun, Xin-Ping Zhang, Ze-Jun Zhang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

Ultrasound-assisted soldering process performance of Sn-Ag-Ti(Ce, Ga) active solders on thin film ZnO substrate

Tao Sun, Xin-Ping Zhang, Ze-Jun Zhang, 2019, 2019 20th International Conference on Electronic Packaging Technology(ICEPT).

A Three-Dimensional Printable Liquid Metal-Like Ag Nanoparticle Ink for Making a Super-Stretchable and Highly Cyclic Durable Strain Sensor.

X. Ning, Min-bo Zhou, Tao Sun, 2021, ACS applied materials & interfaces.

Combination of a Push-Pull-Block Strategy with a Heterologous Xylose Assimilation Pathway toward Lipid Overproduction from Lignocellulose in Yarrowia lipolytica.

R. Ledesma-Amaro, Tao Sun, Lexin Wang, 2023, ACS synthetic biology.

Effects of underfill thickness on mechanical properties and fracture behavior of Si/underfill/Si adhesion structures

Min-bo Zhou, Tao Sun, Xin-Ping Zhang, 2020, 2020 21st International Conference on Electronic Packaging Technology (ICEPT).