Ching-Kuan Lee
发表
M. Kao,
W. Lo,
J. Lau,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Cheng-Ta Ko,
Li-Cheng Shen,
Chien-Wei Chien,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
W. Lo,
T. Kuo,
Chao-Kai Hsu,
2008,
2008 58th Electronic Components and Technology Conference.
Tao-Chih Chang,
C. Ko,
Li-Cheng Shen,
2007,
2007 International Microsystems, Packaging, Assembly and Circuits Technology.
Tao-Chih Chang,
Chao-Kai Hsu,
Yin-Po Hung,
2010,
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
John H. Lau,
Ming-Jer Kao,
Tzu-Kun Ku,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Kuo-Shu Kao,
Yin-Po Hung,
Ren-Shin Cheng,
2011,
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
M. Kao,
W. Lo,
J. Lau,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Kuo-Shu Kao,
J. H. Lau,
Chau-Jie Zhan,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Kuo-Shu Kao,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer
Sheng-Tsai Wu,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.