H. Chien
发表
M. Kao,
W. Lo,
J. Lau,
2014,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
D. Yao,
Chun-Kai Liu,
H. Chien,
2012,
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
D. Yao,
H. Chien,
W. Lai,
2008
.
G. Luo,
Shih-Chiang Huang,
M. Dai,
2008
.
Yu-Hsiang Chang,
C. Kao,
H. Chien,
2023,
Applied Thermal Engineering.
D. Yao,
M. Dai,
R. Tain,
2013
.
Mei-Jiau Huang,
Heng-Chieh Chien,
Tien-Yao Chang,
2008,
The Review of scientific instruments.
D. Yao,
H. Chien,
Cheng-Ting Hsu,
2008
.
Chung-Lung Chen,
H. Chien,
Sheng Wang,
2021,
Physics of Fluids.
Ying-Chung Chen,
H. Chien,
C. Wen,
2015
.
J. Lau,
H. Chien,
Shang-Tsai Wu,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
M. Brillhart,
Peng Su,
J. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Sheng-Tsai Wu,
John H. Lau,
Heng-Chieh Chien,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
Sheng-Tsai Wu,
John H. Lau,
Heng-Chieh Chien,
2011
.
Sheng-Tsai Wu,
John H. Lau,
T.-H. Chen,
2011
.
M. Kao,
W. Lo,
J. Lau,
2013
.
D. Yao,
Mei-Jiau Huang,
H. Chien,
2008,
The Review of scientific instruments.
M. Kao,
W. Lo,
J. Lau,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Kuo-Shu Kao,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Design, fabrication, and calibration of stress sensors embedded in a TSV interposer in a 300mm wafer
Sheng-Tsai Wu,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
Sheng-Tsai Wu,
Heng-Chieh Chien,
J. H. Lau,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
J. Lau,
H. Chien,
Shang-Tsai Wu,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Mei-Jiau Huang,
H. Chien,
You-Rong Shaw,
2019,
International Journal of Thermal Sciences.