N. Hotellier

Reflow processes in micro-bumps studied by synchrotron X-ray projection nanotomography

P. Bleuet, P. Cloetens, J. Charbonnier, 2014 .

Effect of intermetallic compound thickness on shear strength of 25 μm diameter Cu-pillars

J. Charbonnier, F. Hodaj, J. Bertheau, 2014 .

Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors

F. Fournel, F. Gigon, E. Deloffre, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Through Silicon Via Implementation in CMOS Image Sensor Product

X. Gagnard, N. Hotellier, 2011 .

Microstructural and morphological characterization of SnAgCu micro-bumps for integration in 3D interconnects

N. Hotellier, P. Coudrain, J. Charbonnier, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Fully Optimized Cu based process with dedicated cavity etch for 1.75μm and 1.45μm pixel pitch CMOS Image Sensors

J. Vaillant, C. Cowache, Y. Cazaux, 2006, 2006 International Electron Devices Meeting.

Characterization and modelling of Si-substrate noise induced by RF signal propagating in TSV of 3D-IC stack

R. Anciant, A. Farcy, T. Lacrevaz, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Use of optical metrology techniques for uniformity Control of 3D stacked IC's

P. Bar, D. Le Cunff, M. Tardif, 2014, 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014).