Dong wook Kim

Filler trap and solder extrusion in 3D IC thermo-compression bonded microbumps

K. Tu, D. Parkinson, Yingxia Liu, 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

A metastable phase of tin in 3D integrated circuit solder microbumps

N. Tamura, K. Tu, Yingxia Liu, 2015 .

RF performance degradation in nMOS transistors due to hot carrier effects

Chong-Gun Yu, Hyun-Kyu Yu, Dong Wook Kim, 2000 .

Direct Thermal Growth of Large Scale Cl-doped CdTe Film for Low Voltage High Resolution X-ray Image Sensor

Dong Woon Kim, S. Im, Jin Sung Kim, 2018, Scientific Reports.

Preparation of Aluminum Oxide Layer for Gate Insulator Application in Organic Thin-Film Transistors

Jaehoon Park, Dong wook Kim, J. Choi, 2010 .

Preparation of poly(4-vinylphenol)/titanium dioxide composite and its application as a gate dielectric for organic thin-film transistors.

S. Lee, Jaehoon Park, H. Choi, 2011, Journal of nanoscience and nanotechnology.

Evaluation of electromigration (EM) life of ENEPIG and CuSOP surface finishes with various solder bump materials

S. Pai, Dong wook Kim, J. K. J. Lee, 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

Joule Heating Enhanced Electromigration Failure in Redistribution Layer in 2.5D IC

K. Tu, Yingxia Liu, Menglu Li, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Synergistic effect of electromigration and Joule heating on system level weak-link failure in 2.5D integrated circuits

K. Tu, Yingxia Liu, Menglu Li, 2015 .